February 26, 2026 -
By Saumitra Jagdale, EE Times
Semidynamics announced its expansion into full-stack AI infrastructure solutions and revealed that it has taped out its designs at 3 nm with TSMC. As a collaborator in various programs backed by the EuroHPC Joint Undertaking, the Barcelona, Spain-based company could mark a step forward for Europe’s semiconductor ambitions.
“We started as an IP company selling our processor, vector unit, and tensor unit designs,” Iakovos Stamoulis, CTO at Semidynamics, told EE Times. “We are now becoming a vertically integrated AI hardware supplier, where we use our already proven IP technology to create our own silicon products available in boards and racks in due course.”
Semidynamics designs process-agnostic IP cores. The company’s IP cores, including Cervell NPU and Atrevido, are compatible with 5-nm and more mature process nodes. “To be competitive in today’s landscape, we need to use cutting-edge technology, such as 3 nanometers,” Stamoulis said. By taping out its designs with TSMC, Semidynamics is “testing all our technologies and ensuring we have a solution that is functional, operational, and within our power, performance, and area limits at 3 nm.”