Catalog of SIP Cores
System on Chip design resources
System on Chip design resources
October 8, 2026 -
The agreement was formalised through a Memorandum of Understanding (MOU) signed in Kumamoto City, with the partnership bringing together Kumamoto University, Yamagata University, Fraunhofer IZM, and Fraunhofer EMFT, with support from the Japan External Trade Organization (JETRO).
The four institutions will establish a collaborative research framework focused on areas including semiconductor packaging, system integration and printed electronics, while expanding researcher and student exchanges, joint R&D and knowledge sharing between Japan and Germany.