​Applied Materials, Intel Partner on Next-Generation Chip Manufacturing Technology

October 8, 2026 -

​Collaboration Targets Foveros-Based 3D Packaging

By JEONG IL JOO, thelec.net

Applied Materials is partnering with Intel to develop next-generation semiconductor manufacturing technologies.

​Applied Materials stated on October 6 that Intel has joined the Applied EPIC Center as a founding partner. The two companies will jointly research and develop process technologies and equipment across the front-end-of-line (FEOL), back-end-of-line (BEOL), and packaging stages of semiconductor manufacturing.

​The collaboration is aimed at supporting higher interconnect density, improved power delivery, and enhanced thermal performance for high-performance computing (HPC) platforms. HPC platforms refer to integrated computing systems designed to support workloads suited to agentic artificial intelligence (AI).

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