Rapid Bridge announces Value and Innovate Pricing Plans
Qualcomm to Acquire the Assets of Semiconductor Design Innovator Rapid Bridge (June 10, 2011)
San Diego California -- March 17, 2009 -- Rapid Bridge LLC, a premier provider of IP, today announced two new plans to meet the needs of SoC customers:-
The Value Plan — Enables our customers to use our entire IP portfolio (IOs, USB 2.0/3.0, DDR2/3, SerDes, etc.) for a fixed fee, offering great value. The value plan reduces your IP bill; for example, the IP bill for an SoC chip utilizing DDR2, USB2.0 and SerDes is ~$750K. The Value Plan offers the same combination, plus the additional IPs needed for tape-out at a price that is far below the $700K mark.
-
The Innovate Plan — In the spirit of partnership and to encourage innovation, this plan offers our customers the option to only pay 50% of the IP fees at engagement time, and the remainder when they go to production.
“As far as I know, the Innovate Plan remains unique; there is nothing else out there like it (that I know of), so it is exciting for us and for our customer during the current times”.
“Our broader aim is to lower barriers of entry and unleash innovations. I think we have achieved this with our new pricing plans. Both Value and Innovate plans create tremendous value for our customers,” said Randy Wayland, Rapid Bridge’s Technical Marketing Director.
About Rapid Bridge LLC
Rapid Bridge is a privately-held corporation providing solutions at 65 nm, 90 nm and beyond. The company has developed a patented chip-level approach to IC development that dramatically outperforms the industry on speed, area and power. For additional information, please contact Alex Mazloom at Rapid Bridge or refer to our website: http://www.rapidbridge.com
|
Related News
- Qualcomm to Acquire the Assets of Semiconductor Design Innovator Rapid Bridge
- Rapid Bridge Enters into Distribution Agreement with Cadence
- Rapid Bridge Acquires QThink IC Design
- Rapid Bridge Tapes Out World's Smallest USB 2.0/3.0 PHY
- Rapid Bridge Technology Selected by AppliedMicro for Multi-Platform Advanced Nanometer System-on-Chip Development
Breaking News
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
- TSMC Reports First Quarter EPS of NT$8.70
- Brisbane Silicon publishes DPTx 1.4 IP Core
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
Most Popular
- U.S. Subsidy for TSMC Has AI Chips, Tech Leadership in Sight
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass Production
- Silvaco Announces Expanded Partnership with Micron Technology
- OPENEDGES Unveils ENLIGHT Pro: A High-Performance NPU IP Quadrupling its Previous Generation's Performance
E-mail This Article | Printer-Friendly Page |