1-112Gbps Medium Reach (MR) and Very Short Reach (VSR) SerDes
Multicore CPUs face slow road in comms
Rick Merritt, EETimes
(03/20/2009 2:06 PM EDT)
SANTA CLARA, Calif. — The transition to multicore processors in communications and networking systems is expected to be a slow one due to complex and fragmented nature of the underlying technology, predicted a technology analyst.
Processors with four or more cores will probably represent little more than 10 percent of the communications systems market in 2012, according to Linley Gwennap, principal analyst with The Linley Group (Mountain View, Calif.). He was speaking at a panel at this week's Multicore Association Expo here.
By contrast the use of single-core processors is still on the rise in embedded systems, peaking at about half the market over the period. The PowerQuicc, a unique heterogeneous architecture from Freescale Semiconductor that represented another large swath of the market, is on the decline as the company transitions to a simpler dual-core architecture, he said.
Gwennap projected that such dual-core designs could command as much as 20 percent of the market by 2012.
E-mail This Article | Printer-Friendly Page |
Related News
- China readies first multicore Godson CPUs
- Socionext Announces Collaboration with Arm and TSMC on 2nm Multi-Core Leading CPU Chiplet Development
- Green Hills Software adds support for production-ready RTOS and tools to Imagination Technologies' RISC-V CPUs
- Join Andes at RISC-V Summit; Learn the Only ISO 26262 Fully-Compliant RISC-V CPU, the Latest Multicore 4-Way Out-Of-Order Processor & the Multicore 1024-bit Vector Processor
- Arm CPUs Make Gains in Data Centers
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process