Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
Ciranova and TSMC Announce Strategic Partnership on Advanced PDK Technology
“Ciranova’s PyCell technology and advanced architecture provides native support of interoperable PDKs, which are an integral part of our Open Innovation Platform™, to facilitate and accelerate designers' innovations in analog and full custom designs,” said Fu-Chieh Hsu, vice president of Design & Technology Platform at TSMC. “We are collaborating with Ciranova to develop the industry’s first interoperable PDK, a single PDK that supports multiple design environments. We continue to work with Ciranova and the interoperable PDK Library (IPL) Alliance to accelerate the deployment and adoption of interoperable PDK across the industry.” “Every leading-edge SoC company in the world is under pressure to ramp more advanced design kits faster, despite limited time and resources,” said Eric Filseth, CEO of Ciranova. “TSMC is the foundry gold standard, and we’re excited to be working with them to push the state of the art of PDKs forward.”
About PyCells
Ciranova interoperable PyCells are a next-generation approach to parameterized cell development for custom IC design. Unlike older PCell approaches, the PyCell architecture is design-rule aware and generates DRC-correct device geometry automatically; the result is a major reduction in user coding effort, particularly at nanometer process nodes. PyCells run in any OpenAccess-capable EDA tool, and were selected as the physical foundation for the Interoperable PDK Alliance at http://www.iplnow.com. The PyCell Studio development system is a free download from http://www.ciranova.com.
About TSMC
TSMC is the world’s largest dedicated semiconductor foundry, providing the industry’s leading process technology and the foundry’s largest portfolio of process-proven libraries, IP, design tools and reference flows. The Company’s total managed capacity in 2008 exceeded 9 million (8-inch equivalent) wafers, including capacity from two advanced 12-inch - GIGAFABs ™, four eight-inch fabs, one six-inch fab, as well as TSMC’s wholly owned subsidiaries, WaferTech and TSMC (Shanghai), and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please see http://www.tsmc.com.
About Ciranova
Ciranova is an electronic design automation (EDA) company focused on very large productivity improvements in analog, RF and mixed-signal IC physical design. Complementary to existing design flows, Ciranova technology dramatically reduces the time and effort needed to develop device-level layout at both the circuit and PDK levels, while delivering results of equal or better quality than purely handcrafted methods. Ciranova supports the Si2 OpenAccess database. For more information please visit http://www.ciranova.com.
|
Related News
- Synopsys and TSMC Usher In Angstrom-Scale Designs with Certified EDA Flows on Advanced TSMC A16 and N2P Processes
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
- eMemory Won TSMC OIP Partner of the Year Award for the Outstanding Development of its NVM IP on Advanced Nodes
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |