English
Analysis: Dual Cortex-A9 cores figure drive OMAP 4
BDTI
(03/30/2009 11:13 PM EDT)
Texas Instruments recently announced its next-generation application processor family, OMAP 4. The OMAP 4 chip family targets smart phones and mobile internet devices (MIDs) and incorporates a number of distinct processing engines.
General-purpose processing is provided via a dual-core SMP processor based on two ARM Cortex-A9 cores, both of which include the NEON multimedia extensions. As shown in Figure 1 below, OMAP 4 chips also include an imaging engine (TI’s ISP), graphics engine (Imagination Technologies’ POWERVR SGX540), programmable video engine (TI’s IVA3) and “audio backend engine” (TI’s ABE).
(Click to enlarge)
Figure 1: Inside the OMAP 4, courtesy of Texas Instruments
(03/30/2009 11:13 PM EDT)
Texas Instruments recently announced its next-generation application processor family, OMAP 4. The OMAP 4 chip family targets smart phones and mobile internet devices (MIDs) and incorporates a number of distinct processing engines.
General-purpose processing is provided via a dual-core SMP processor based on two ARM Cortex-A9 cores, both of which include the NEON multimedia extensions. As shown in Figure 1 below, OMAP 4 chips also include an imaging engine (TI’s ISP), graphics engine (Imagination Technologies’ POWERVR SGX540), programmable video engine (TI’s IVA3) and “audio backend engine” (TI’s ABE).
(Click to enlarge)
Figure 1: Inside the OMAP 4, courtesy of Texas Instruments
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- Variscite announces the VAR-SOM-OM44 OMAP4460, 1.5GHz Dual-Core
- Ittiam introduces Android-based HD video conferencing on Texas Instruments OMAP 4 platform
- Samsung Introduces High Performance, Low Power Dual CORTEX-A9 Application Processor for Mobile Devices
- Imagination's POWERVR SGX540 Demonstrated in Texas Instruments' Latest OMAP 4 Platform
- ARM Announces 2GHz Capable Cortex-A9 Dual Core Processor Implementation
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation