English
Video: Where hardware and software collide
Dylan McGrath, EE Times
(04/03/2009 8:55 PM EDT)
SAN JOSE, Calif.—Chipmakers are taking on responsibility for the development of more embedded software, resulting in a clash of cultures between hardware designers and software developers and necessitating a more system-level approach to design, according to executives on a panel discussion at ESC Silicon Valley this week.
Chris Rowen, chief technology officer at chip and IP vendor Tensilica Inc., said his company tackles this clashing of cultures by work with both sides to understand what pressures they are under—reliability and flexibility on the hardware side, and power efficiency and cost on the software side.
Ultimately, Rowen said, program managers and system designers or whoever is responsible for the combination hardware and software deliverable is the "ultimate arbitrator in how you bring these two together." Rowen added that the emergence of multicore architecture has contributed to the blurring of hardware and software design.
(04/03/2009 8:55 PM EDT)
SAN JOSE, Calif.—Chipmakers are taking on responsibility for the development of more embedded software, resulting in a clash of cultures between hardware designers and software developers and necessitating a more system-level approach to design, according to executives on a panel discussion at ESC Silicon Valley this week.
Chris Rowen, chief technology officer at chip and IP vendor Tensilica Inc., said his company tackles this clashing of cultures by work with both sides to understand what pressures they are under—reliability and flexibility on the hardware side, and power efficiency and cost on the software side.
Ultimately, Rowen said, program managers and system designers or whoever is responsible for the combination hardware and software deliverable is the "ultimate arbitrator in how you bring these two together." Rowen added that the emergence of multicore architecture has contributed to the blurring of hardware and software design.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- Space Codesign Systems to Release Version 2.4
- New Integration Between SpaceStudio Hardware Software Co-design and European Space Agency’s TASTE Tool Set
- ViXS Systems Introduces Turnkey Hardware and Software Blu-ray & Personal Video Recorder (PVR) Reference Design available for Set-top and Consumer Electronics Manufacturers
- Is Software and Hardware Ready for TinyML Tsunami?
- OpenHW Group Announces Tape Out of RISC-V-based CORE-V MCU Development Kit for IoT Built with Open-Source Hardware & Software
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing