Rocketchips introduces Gigabit Speed CMOS Transceivers for Fibre Channel and Gigabit Ethernet Applications
Contacts: | ||
RocketChips, Inc. Tim Hemken Director of Sales and Marketing 612/948-0000 (ext.309) themken@rocketchips.com | The Sage Group Joe Jennings 612/321-9897 jennings@sagegrp.com |
FOR IMMEDIATE RELEASE
ROCKETCHIPS INTRODUCES GIGABIT SPEED CMOS TRANSCEIVERS
FOR FIBRE CHANNEL AND GIGABIT ETHERNET APPLICATIONS
IP CORES ARE AVAILABLE IN PURE-PLAY FOUNDRIES
MINNEAPOLIS (August 2, 1999) – RocketChips, Inc. (www.rocketchips.com) a leading silicon-CMOS designer of high speed, high performance analog, RF (radio frequency) and mixed-signal intellectual property (IP) cores, today announced the availability of two new transceivers for industry standard applications: Gigabit Ethernet (1000BaseX) and Fibre Channel. These CMOS transceiver cores are available as licensable IP for fabrication at pure play foundries and in customer proprietary processes. RocketChips believes it is the first IP provider to offer these gigabit speed transceivers as licensable intellectual property for both pure play foundries and captive fabs.
The silicon-proven transceiver cores utilize an innovative, patent-pending architecture that was developed by RocketChips to meet the industry specifications for Gigabit Ethernet IEEE 802.3z and Fibre Channel ANSI X3T11. The cores can be fabricated as fully functional standard products or integrated for use in ASICs and other highly integrated devices.
The Gigabit Ethernet transceiver, the RC13110, operates at 1.25Gbps over fiber. The Fibre Channel transceiver, the RC12110, provides data transmission rates of 1.0625Gbps. The two transceivers are immediately available for sampling in RocketChips' Gigabit Transceiver Evaluation Board.
"Our demonstration of fully functional gigabit-speed silicon, in both a test bench environment and in a full network application, is a major step to bringing these transceiver IP cores to the market," stated Dr. Scott Irwin, RocketChips Vice President of Engineering. "These successful demonstrations provide validation of our technology as we continue to accelerate CMOS transceiver development for Gigabit Ethernet over copper, 2X Fibre Channel and 2.5Gbps serial links."
RocketChips, Inc. is a silicon-CMOS designer of high speed, high performance analog, RF and mixed-signal integrated circuits and related IP for the wired and wireless communication markets. The Company licenses its reusable IP components (under the trademark "RocketIP") for use in the creation of advanced Systems-on-a-Chip and other complex integrated circuits and systems addressing a wide range of applications in the communication markets. RocketChips is headquartered in Minneapolis and maintains additional IC design centers in Ames, Iowa, and Austin, Texas.
Related News
- MystiCom and TSMC Partner to Speed System On Chip (SOC) Design <!--<FONT SIZE=-1>(by Peter Clarke - EE-TIMES)</FONT>-->
- Palmchip Introduces New GreenLite™ II Family of Complete System-On-Chip IP Solutions for Disk Drive Control <!--<FONT SIZE=-1>(by Peter Clarke - EE-TIMES)</FONT>-->
- Microsemi Announces Collaboration with New Wave DV to Develop Innovative Networking Products and IP Cores for Ethernet and Fibre Channel Solutions
- Vitesse Introduces IP Cores for Consumer, Enterprise and Industrial Applications
- Aizyc Technology introduces USB 3.0 Device IP with a production worthy USB 3.0 to Gigabit Ethernet application
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |