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High performance dual-issue, out-of-order, 7-stage Vector processor (DSP) IP
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CEO Otellini wants 3G silicon blocks for Atom
Rick Merritt, EE Times
(05/13/2009 1:02 AM EDT)
SANTA CLARA, Calif. — Intel Corp. plans to offer 3G cellular silicon as part of its move into systems-on-chip for networked devices, said chief executive of Paul Otellini. Separately, the company will not try to offer a 28 nm process technology despite comments some will use that interim node.
"We want to have that [3G] capability," said Otellini in a Q&A session at an annual analysts meeting here. Cellular silicon "could be in a daughter card, but in some platforms it needs to be integrated into the SoC, and we want to be able to do any configuration," he said.
Otellini said he had nothing to announce about how or when Intel would obtain 3G silicon.
Rick Merritt, EE Times
(05/13/2009 1:02 AM EDT)
SANTA CLARA, Calif. — Intel Corp. plans to offer 3G cellular silicon as part of its move into systems-on-chip for networked devices, said chief executive of Paul Otellini. Separately, the company will not try to offer a 28 nm process technology despite comments some will use that interim node.
"We want to have that [3G] capability," said Otellini in a Q&A session at an annual analysts meeting here. Cellular silicon "could be in a daughter card, but in some platforms it needs to be integrated into the SoC, and we want to be able to do any configuration," he said.
Otellini said he had nothing to announce about how or when Intel would obtain 3G silicon.
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