English
NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Start-up claims breakthrough in reconfigurable logic
John Walko, EE Times
(05/28/2009 6:51 AM EDT)
LONDON — A British company focused on dynamically reconfigurable logic technology, Akya (Selby, England), has launched its first device, dubbed the ART2.
Akya says it has taken a fundamentally different approach to previous reconfigurable logic technologies, and has managed to reduce the risk, silicon area and costs involved in the production of flexible ICs.
The privately held start-up has been developing the 'ART' technology since 2005, and says the technology simplifies the design and implementation of reconfigurable chips by separating dataflow circuitry from control logic.
The company says its "ground-breaking" reconfigurable logic technology redefines low-cost, low-power logic design by bringing the benefits of reconfigurability to price-and power-sensitive markets.
(05/28/2009 6:51 AM EDT)
LONDON — A British company focused on dynamically reconfigurable logic technology, Akya (Selby, England), has launched its first device, dubbed the ART2.
Akya says it has taken a fundamentally different approach to previous reconfigurable logic technologies, and has managed to reduce the risk, silicon area and costs involved in the production of flexible ICs.
The privately held start-up has been developing the 'ART' technology since 2005, and says the technology simplifies the design and implementation of reconfigurable chips by separating dataflow circuitry from control logic.
The company says its "ground-breaking" reconfigurable logic technology redefines low-cost, low-power logic design by bringing the benefits of reconfigurability to price-and power-sensitive markets.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
|
||||||
Related News
- Startup claims breakthrough in SoC routing
- Reconfigurable semiconductor IP start-up raises $14 million - backed by 3i, Actel, HP
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing
- Startup Claims Low-power IoT Geolocation Without a Positioning Chipset
- Soitec Becomes Strategic Partner of Silicon Catalyst Start-up Incubator
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation