Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
Tensilica Announces Strategic Investment by DOCOMO Capital
Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
SANTA CLARA, Calif. – June 22, 2009 – Tensilica, Inc. today announced that DOCOMO Capital, Inc. has made a strategic investment in Tensilica. DOCOMO Capital is the corporate venture arm of NTT DOCOMO, Japan’s leading wireless carrier. Tensilica is a major semiconductor IP (intellectual property) supplier specializing in dataplane processor cores, which are a combination of CPU (central processing unit) and DSP (digital signal processor) that can be rapidly customized to provide 10-100x the performance of standard CPUs and DSPs. Tensilica’s DPUs (dataplane processing units) are widely used in system-on-chip (SoC) designs for mobile consumer devices.“We recognize the growing importance of Tensilica’s customizable DPUs for semiconductors that enable lower power and innovative mobile devices, and that’s why we made this investment,” stated Tomoya Hemmi, president and CEO, DOCOMO Capital. “Tensilica’s high-performance DPUs for audio, video and baseband functions will be key enablers for new capabilities and increased battery life in future mobile telephones.”
“NTT DOCOMO is well respected for its deep involvement in the holistic design of its mobile networks, down to the algorithms, semiconductors and systems technology employed in the handsets. We are excited about our new, closer relationship with this tech savvy carrier and work with them to drive new technology and the early deployment of new standards,” stated Jack Guedj, Tensilica’s president and CEO. “We are also pleased that our major capital investors - Foundation Capital, Meritech Capital Partners, Oak Investment Partners and Worldview Technology Partners - participated along with DOCOMO Capital in this financing round.”
Tensilica, Inc. is a privately held company. The Gartner Group, in its March 2009 report on the semiconductor IP market, recognized Tensilica as the fastest-growing semiconductor IP supplier
About DOCOMO Capital
DOCOMO Capital, Inc. is a wholly owned U.S. subsidiary of NTT DOCOMO, INC. (NYSE:DCM), the leading wireless network operator based in Japan. Working closely with NTT DOCOMO’s business and R&D divisions, DOCOMO Capital is in charge of NTT DOCOMO’s strategic investments in mobile communications related start-up companies mainly in the United States. For more information, visit www.docomo-capital.com.
About Tensilica
Tensilica, Inc. – the leader in customizable dataplane processors – is a semiconductor IP licensor recognized by the Gartner Group as the fastest growing semiconductor IP supplier in 2008. Dataplane Processor Units (DPUs) combine the best capabilities of CPUs and DSPs while delivering 10-to-100-times the performance because they can be customized using Tensilica’s automated design tools to meet specific dataplane performance targets. Tensilica’s DPUs power SOC designs at system OEMs and five out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes and portable media players), computers, and storage, networking and communications equipment. For more information on Tensilica’s patented, benchmark-proven DPUs visit www.tensilica.com.
|
Related News
- Rocketick Secures Strategic Investment from Intel Capital and NVIDIA
- Tensilica Inc. Announces Strategic Investment by Fujitsu
- Intel Announces Strategic Investment by Silver Lake in Altera
- Chiplet interconnect pioneer Eliyan gains additional financial backing from AI chip ecosystem with strategic investment from VentureTech Alliance
- Imagination Technologies announces new capital investment from Fortress Investment Group
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |