Gennum Debuts PCI Express 3.0 IP, Showcases Bridging Solutions for HD Video at PCI-SIG
July 9, 2009 -- Gennum Corporation (TSX: GND) continues to push performance limits for PCI Express (PCIe) with demonstrations next week at the PCI-SIG Developers Conference being held in San Jose July 15-16. Gennums Snowbush IP group will showcase the industry's first public demonstration of a PCIe 3.0 PHY, highlighting its unprecedented electrical performance, as well as demonstrations of PCIe 2.0 and SATA IP in a PCIe SATA bridge. Gennum will also demonstrate 3 gigabits (Gb/s) live video capture using Gennum's PCIe 2.0 solutions, underscoring the potential for PCIe in SDI video applications.
Technical experts from Gennum will also present at the two-day conference, an event designed to provide intensive training on all aspects of PCIe.
What:
- PCIe HD Video Capture Demonstration
- PCIe 3.0 PHY IP Demonstration
- “Anatomy and Applications of PCIe Switching Technology” Paper Presentation
- “Optimizing PCIe Performance in PCs & Embedded Systems” Paper Presentation
PCI-SIG Conference, San Jose Convention Center, Gennum Booth #14
About Gennum
Gennum Corporation (TSX: GND) designs innovative semiconductor solutions and intellectual property (IP) cores for the worlds most advanced consumer connectivity, enterprise, video broadcast and data communications products. Leveraging the companys proven optical, analog and mixed-signal products, and IP, Gennum enables multimedia and data communications products to send and receive information without compromising the signal integrity. A recognized award-winner for advances in high definition (HD) broadcasting, Gennum is headquartered in Burlington, Canada, and has global design, research and development and sales offices in Canada, Germany, India, Japan, Korea, Mexico, Taiwan, the United States and the United Kingdom.
|
Related News
- Northwest Logic's PCI Express 3.0 Solution passes PCI-SIG PCIe 3.0 Compliance Testing at First Official PCIe 3.0 Compliance Workshop
- Cadence Demonstrates PCI Express 3.0 Offering at 2011 PCI-SIG Developers Conference
- PCI-SIG Releases PCI Express 3.0 Specification
- PCI-SIG Announces PCI Express 3.0 Bit Rate for Products in 2010 and Beyond
- Mobiveil's GPEX PCI Express 3.0 IP Passes PCI-SIG PCIe 3.0 Compliance Testing
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |