Samsung First to Begin Mass Producing 2-Gigabit DDR3 Using 40nm Class Technology
"We see market adoption to DDR3 picking up steam and are accommodating that with early entry of 2Gb DDR3 using the most efficient DRAM manufacturing technology available today," said Jim Elliott, Vice President, Memory Marketing, Samsung Semiconductor, Inc. "This will set the pace for a new standard in premium, eco-friendly DRAM solutions offering the most advanced, low power RDIMM for servers anywhere."
Samsung"s seven-month window between new process technology development and mass production of the new DDR3 (Jan. to Jul. '09) will allow OEMs to optimize their next-generation systems more quickly.
In addition, moving to a 40nm production process will provide around a 60 percent increase in production productivity over use of a 50 nm process.
Besides 16GB, 8GB and 4GB RDIMMs for servers, Samsung will produce UDIMMs (unregistered in-line memory modules) for workstations or desktop PCs or SODIMMs (small outline dual in-line memory modules) for notebook PCs of up to 4GBs, using the new chip.
The monolithic 2Gb chips are energy-efficient solutions for high-density, high-performance memory applications. Each supports a data rate of up to 1.6 gigabits per second (Gbps) at 1.35 volts, up to twice as fast as an 800Mbps 1Gb-based dual-die package.
According to market research firm iSuppli, 2 Gb DDR3 is expected to account for 82 percent of the total DDR3 DRAM market in units sold by 2012, and become the mainstream DDR3 DRAM product by 2010.
About Samsung Electronics
Samsung Electronics Co., Ltd. is a global leader in semiconductor, telecommunication, digital media and digital convergence technologies with 2008 consolidated sales of US$96 billion. Employing approximately 164,600 people in 179 offices across 61 countries, the company consists of two business units: Digital Media & Communications and Device Solutions. Recognized as one of the fastest growing global brands, Samsung Electronics is a leading producer of digital TVs, memory chips, mobile phones and TFT-LCDs. For more information, please visit www.samsung.com.
|
Related News
- Samsung First to Begin Mass Producing 2-Gigabit Green DDR3 Using 30nm Class Technology
- Samsung Starts Mass Producing Industry's First 10-Nanometer Class DRAM
- Samsung Now Mass Producing Industry's First, 20-Nanometer 6Gb LPDDR3 Mobile DRAM
- Samsung Begins Mass Producing Industry's Highest Density (128GB) Embedded NAND Storage
- Samsung Mass Producing Highly Efficient Embedded Multi-Chip Memory for Entry-level Smartphones
Breaking News
- Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
- Andes Technology D45-SE Processor Achieves ISO 26262 ASIL-D Certification for Functional Safety
- VeriSilicon and Innobase collaboratively launched second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP
- ARM boost in $100bn Stargate data centre project
- MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
E-mail This Article | Printer-Friendly Page |