Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
The TSMC Tsunami at DAC 2009
edadesignline.com (July 28, 2009)
In a well-orchestrated and clearly scripted show of force, the CEOs of the three "largest" companies in EDA appeared together under the Big Top at the 2009 Design Automation Conference in San Francisco on Monday, July 27th, for a highly touted afternoon keynote panel purportedly addressing "Futures for EDA."
There was only one problem with the event: The CEO of the single largest company in EDA was not actually there. Given that TSMC is listed more than any other company on the roster of exhibitors at DAC 2009, 13 different times, TSMC CEO Morris Chang should, in fact, have been seated on stage, side-by-side with Synopsys CEO Aart de Geus, Mentor Graphics CEO Wally Rhines, and Cadence CEO Lip-Bu Tan.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Synopsys and TSMC Usher In Angstrom-Scale Designs with Certified EDA Flows on Advanced TSMC A16 and N2P Processes
- EDA toolset parade at TSMC's U.S. design symposium
- TSMC's 3-nm Push Faces Tool Struggles
- Synopsys and TSMC Collaborate to Jumpstart Designs on TSMC's N2 Process with Optimized EDA Flows
- Synopsys Advances Designs on TSMC N3E Process with Production-Proven EDA Flows and Broadest IP Portfolio for AI, Mobile and HPC Applications
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation