Cadence and GLOBALFOUNDRIES Announce Broad, Multi-Year Technology Agreement
SAN JOSE, Calif. -- Aug 31, 2009 -- Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic design innovation, and GLOBALFOUNDRIES Inc., a leading-edge semiconductor manufacturing company, today announced that the two companies have entered into a multi-year software and services agreement for advanced semiconductor design. As part of the agreement, GLOBALFOUNDRIES has adopted a comprehensive suite of Cadence® technologies to aid in the design, verification and manufacturing of complex semiconductor devices targeting process technologies of 45 nanometers and below. In addition, GLOBALFOUNDRIES will team with the Cadence Services organization to build differentiated design-enablement capabilities to support customers at advanced process nodes.
GLOBALFOUNDRIES chose Cadence because of its strong interest in creating a broad, open design flow that enables fast, accurate and easy access to Cadence technology. The foundry has adopted the Cadence Virtuoso® and Encounter® design environments, as well as specialized technologies for diagnostics, IP validation and parasitic extraction, complemented by support services.
“Cadence technology and services will be important tools to help ensure that GLOBALFOUNDRIES has the enablement infrastructure necessary to support complex customer designs,” said Mojy Chian, senior vice president of design enablement at GLOBALFOUNDRIES. “Our customers are operating at the leading edge of technology, and it is absolutely critical to offer them a standardized and seamless flow that facilitates working silicon. Cadence’s expertise in custom design is an important addition as we build a global partner ecosystem to efficiently bring the world’s most sophisticated chip designs to market.”
“Providing best-in-class solutions for tomorrow’s toughest design challenges, ahead of the curve, requires continuous innovation and tight collaboration with our customers and business partners,” said Lip-Bu Tan, Cadence president and CEO. “Working closely with GLOBALFOUNDRIES helps ensure our leadership in low-power, advanced-node, and signoff technologies, and enables Cadence to provide industry-leading design technology and services to a wide range of designers seeking new avenues to market.”
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software and hardware, methodologies, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
|
Cadence Design Systems, Inc. Hot IP
Cadence Design Systems, Inc. Hot Verification IP
Related News
- Cadence and Samsung Foundry Enter Multi-Year Agreement to Expand Design IP Portfolio
- Toppan Photomasks and GLOBALFOUNDRIES Enter into Multi-Year Supply Agreement
- Sondrel extends multi-year, multi-million dollar EDA license with Synopsys
- Sequans Communications Closes Multi-Year Strategic 5G Partnership Agreement
- Alphawave IP and Verisilicon Expand Partnership with $54M Multi-Year Exclusive Subscription Reseller Agreement for China Market
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |