Wavesat Introduces LTE Chipset Featuring 100 Mb/s Downlink Capability
Company’s LTE Chipset Family – the “Odyssey 9000” -- Solidifies Leadership in Multi-Protocol 4G Baseband Processors
San Mateo, CA – September 9, 2009 – Wavesat Inc., a leading supplier of Broadband Wireless semiconductor solutions, will launch its Odyssey 9000 family of LTE chipsets at the 4G World in Chicago next week, with the first LTE chipset featuring CAT-3 performance (100 Mb/s downlink, 50 Mb/s uplink) for mobile devices including USB dongles, data cards, mobile handsets and MIDs. The Odyssey 9000 is a highly integrated SOC with industry beating performance and power consumption, along with a highly flexible and programmable architecture to easily adapt to LTE’s evolving requirements. Wavesat’s award winning multi-protocol architecture also allows the Odyssey 9000 to support other 4G technologies including WiMAX and Japan’s XGP standard.
“As the industry moves rapidly to strategic use of IP applications, such as will be enabled by LTE, Wavesat’s product family and approach appears well positioned to offer an agile response to changing product and market demands,” said Robert Syputa, Partner and Principal Analyst with Maravedis. “What sets the Odyssey 9000 apart from the competitors -- more than a time-to-market advantage -- is that Odyssey 9000 follows a highly flexible and ‘future proof’ system architecture that can help lower life-cycle product costs and provide a migration to multiple radio access network operating or roaming models.”
The Odyssey 9000 family of chipsets incorporates a unique hybrid architecture with a combination of highly efficient DSPs and hardware acceleration blocks, easily scaling to support CAT-4 (150 Mb/s downlink) devices. The first LTE baseband processor in the Odyssey 9000 family, the OD9010, will sample in October 2009, and will come complete with an LTE protocol stack including MAC, RLC, PDCP, RRC and NAS layers, as well as a ready to manufacture reference design. A follow-on dual-mode chip, the OD9050, is scheduled to sample by mid-2010 and will offer both 3G and LTE on the same chipset.
“We are very excited about the feedback from leading network operators and OEMs to our Odyssey 9000 family of products, as it will enable device manufacturers to offer production quality LTE mobile devices with CAT-3 capability by the end of this year,” said Raj Singh, President and CEO of Wavesat. “We are working now with a few lead operators and OEMs to have fully interoperable LTE devices in place to meet the demand as LTE networks go operational worldwide beginning next year.”
About Wavesat
Wavesat is a global leader in mobile broadband, providing advanced semiconductor solutions to the world’s leading carrier and mobile device manufacturers to deploy future-proof broadband services and products. With award winning technology, Wavesat delivers silicon that enables customers to deploy multiple Broadband Wireless technologies such as LTE, WiMAX Wave2 and XGP. Wavesat was recognized as one of Canada’s Top Ten Technology companies for 2009. For more information, please visit www.wavesat.com.
|
Related News
- Acorn Technologies Introduces New Positioning IP Core for LTE Baseband Chipset Market
- Qualcomm Technologies Introduces Snapdragon 410 Chipset with Integrated 4G LTE World Mode for High-Volume Smartphones
- Sequans Introduces Taurus 5G NR: The World's First Chipset Specifically Optimized for 5G Broadband IoT Devices
- Sequans Introduces Calliope 2: A New Generation of LTE Cat 1 Technology for IoT Applications Requiring Higher Than LTE-M Speed
- MediaTek Introduces Helio G35 & G25 Gaming Series Chipsets
Breaking News
- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
- Credo at TSMC 2024 North America Technology Symposium
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
E-mail This Article | Printer-Friendly Page |