NEC licenses Ramtron's FRAM, aims to speed integration in microcontrollers
![]() |
NEC licenses Ramtron's FRAM, aims to speed integration in microcontrollers
By Semiconductor Business News
November 20, 2001 (2:45 p.m. EST)
URL: http://www.eetimes.com/story/OEG20011120S0014
COLORADO SPRINGS, Colo.-- Ramtron International Corp. here today said NEC Corp. has become the ninth company to license its ferroelectric RAM technology. Ramtron said the licensing pact is a multi-million agreement, under which NEC will pay the Colorado company future royalties, certain licensing fees, and milestone payments in return for the nonvolatile FRAM technology. "Through this agreement with Ramtron International, NEC is aiming to accelerate the incorporation of FRAM technology with our microcomputer products such as smart cards," said Yuichi Kawakami, general manager of NEC's Microcomputer Division in Japan. "We want to become the first supplier of FRAM-embedded microcomputers using 0.25-micron-rule process." Three months ago, Ramtron inked a licensing and development agreement with Texas Instruments Inc., which plans to use FRAM storage in its ICs (see Aug. 22 story ). Ramtron has also signed FRAM licensing agreements with Infineon, Fujitsu, Hitachi, Toshiba, Rohm, Samsung, Asahi Chemical, and other companies. "This [NEC] agreement is further evidence that FRAM memory is gaining momentum in the industry," said Greg Jones, technology group president at Ramtron.
Related News
- Texas Instruments licenses Ramtron's FRAM technology
- Benefit from Dolphin Integration's state-of-the-art compiler for 80251 CISC microcontrollers
- NXP Semiconductors unveils industry's first ARM7 microcontrollers with dual high-speed buses
- NEC Electronics (Europe) GmbH Licenses SMSC's MediaLB Technology
- Toshiba Electronics Europe Licenses SMSC's MediaLB Technology; Integration of MediaLB Interface Adds MOST(R) Connectivity to Advanced Automotive Display SoCs
Breaking News
- Arm Holdings plc Reports Results for the Third Quarter of the Fiscal Year Ended 2025
- Why UCIe is Key to Connectivity for Next-Gen AI Chiplets
- CHERI Protects Memory at the Hardware Level
- Axiomise Launches footprint, Area Analyzer for Silicon Design
- Ceva-Waves Wi-Fi 6 IP Powers WUQI Microelectronics Wi-Fi/Bluetooth Combo Chip
Most Popular
- Intel Halts Products, Slows Roadmap in Years-Long Turnaround
- Mirabilis Design Adds System-Level Modelling Support for Industry-Standard Arteris FlexNoC and Ncore Network-on-Chip IPs
- CoMira Solutions unveils its new 1.6T Ethernet UMAC IP
- Accellera Board Approves Universal Verification Methodology for Mixed-Signal (UVM-MS) 1.0 Standard for Release
- intoPIX Unveils Cutting-Edge AV Innovations at ISE 2025
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |