InterDigital Signs Cinterion to Worldwide Patent License Agreement
License Agreement Covers 2G, 3G M2M Modules and PC Cards
KING OF PRUSSIA, Pa., Sep 18, 2009 -- InterDigital, Inc. (NASDAQ: IDCC) today announced that its patent holding subsidiaries have entered into a worldwide, non-transferable, non-exclusive, royalty-bearing patent license agreement with Cinterion Wireless Modules GmbH ("Cinterion"). The agreement covers the sale of Machine-to-Machine (M2M) modules and PC Cards compliant with 2G and 3G cellular standards, for the period January 1, 2009 through the end of 2012.
"This agreement further expands the licensing of InterDigital's current 2G and 3G patents into new areas of opportunity such as the fast-growing M2M market," commented Lawrence Shay, President of InterDigital's patent holding subsidiaries. "Cinterion holds a substantial portion of the growing overall M2M module market."
Cinterion, headquartered in Munich, Germany, is the worldwide leading supplier of cellular M2M communication modules that enable machines, equipment and vehicles to communicate over wireless networks, helping enterprises dramatically cut costs and increase productivity and efficiency. The company's products are used for remote maintenance and control; metering; payment systems; industrial PDAs; routers and gateways; security systems; health care; automotive and eToll; tracking and tracing; environmental monitoring and more.
About InterDigital
InterDigital(R) designs, develops and provides advanced wireless technologies and products that drive voice and data communications. InterDigital is a leading contributor to the global wireless standards and holds a strong portfolio of patented technologies which it licenses to manufacturers of 2G, 2.5G, 3G, and 802 products worldwide.
For more information, on InterDigital, please visit: www.interdigital.com.
|
Related News
- InterDigital Signs Casio Hitachi Mobile Communications to Worldwide 2G and 3G Patent License Agreement
- InterDigital Signs Pantech to Worldwide Patent License Agreement Covering 2G, 3G and LTE Standards
- InterDigital Signs ModeLabs to Worldwide 2G and 3G Patent License Agreement
- InterDigital and Fujitsu Limited Agree to Worldwide Patent License Agreement
- InterDigital Signs SII Mobile Communications to Worldwide Patent License Agreement
Breaking News
- Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
- Secure-IC unveils its Securyzr™ neo Core Platform at Embedded World North America 2024
- OPENEDGES Technology Achieves ISO 26262 ASIL-B Certification
- Xylon's Updated logiHSSL IP Core Seamlessly Connects Infineon AURIX Microcontrollers with AMD Adaptive SoCs and FPGAs
- Electronic System Design Industry Posts $4.7 Billion in Revenue in Q2 2024, ESD Alliance Reports
Most Popular
- RaiderChip brings Meta Llama 3.2 LLM HW acceleration to low cost FPGAs
- NVMe Updates Expand Discoverability, Security
- BrainChip Introduces Lowest-Power AI Acceleration Co-Processor
- Bluetooth® V6.0 Channel Sounding RF Transceiver IP Core in 22nm & 40nm for ultra-low power distance aware Bluetooth connected devices
- Boosting Efficiency and Reducing Costs: Silvaco's Approach to Semiconductor Fabrication
E-mail This Article | Printer-Friendly Page |