SMIC Extends 45nm Offerings to 40nm and 55nm
Shanghai, China -- October 15, 2009 -- Semiconductor Manufacturing International Corporation (“SMIC”, NYSE: SMI and SEHK: 0981.HK) today announced that it will extend its 45-nanometer bulk complementary metal–oxide semiconductor (CMOS) technologies to 40nm and 55nm geometries.
These new processes will complement SMIC’s existing offerings to better support customer demand worldwide, including in the fast-growing China market. Applications include multimedia products, graphics chips, chipsets, and mobile devices such as handsets integrated with 3G/4G.
“Our 45nm technology has been implemented at SMIC’s 300mm facility in Shanghai ahead of schedule and we look forward to a similar result at these additional geometries,” said SMIC’s President and CEO, Dr. Richard Chang. “These new offerings provide our current and new customers a customized set of solutions to meet their diverse product design-in needs.”
About SMIC
Semiconductor Manufacturing International Corporation (“SMIC”; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in Mainland China, providing integrated circuit (IC) foundry and technology services at 0.35um to 45nm. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and three 200mm wafer fabs in its Shanghai mega-fab, two 300mm wafer fabs in its Beijing mega-fab, a 200mm wafer fab in Tianjin, a 200mm fab under construction in Shenzhen, and an in-house assembly and testing facility in Chengdu. SMIC also has customer service and marketing offices in the U.S., Europe, and Japan, and a representative office in Hong Kong. In addition, SMIC manages and operates a 200mm wafer fab in Chengdu owned by Cension Semiconductor Manufacturing Corporation and a 300mm wafer fab in Wuhan owned by Wuhan Xinxin Semiconductor Manufacturing Corporation. For more information, please visit http://www.smics.com.
|
SMIC Hot IP
Related News
- Brite Semiconductor, Naneng Microelectronics and Corigine Collaborate to Release Complete USB 3.0 IP Solution
- Kilopass NVM IP Achieves JEDEC Qualification on High-Demand SMIC 65/55/40nm Processes
- Bluetooth Dual Mode v5.3 RF Transceiver IP Cores in 22nm, 40nm, 55nm is Available for Immediate Licensing for TWS, Audio Chipsets and Automotive Applications
- ACTT's Complete IoT Solution Now Available on SMIC 55nm eFlash Platform
- QuickLogic First to Offer eFPGA Technology on SMIC 40nm Low Leakage Process
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |