200th Company Licenses WiLAN Technologies
OTTAWA, Canada – October 23, 2009 – Wi-LAN Inc., a leading technology innovation and licensing company, today announced that the Company has reached the significant milestone of 200 companies licensed. The 200th company to license WiLAN technologies, Ascom AB, is an international provider of wireless communication and security solutions.
Of the 200 companies now licensed, 77 have signed licenses for wireless-related technologies, 116 for V-Chip-related technologies and seven for wireline or DSL technologies.
“Reaching 200 companies licensed is a key milestone in the growth of our business. Achieving this milestone is a testament to the hard work and dedication of our team and the value of our technology innovations,” said Jim Skippen, Chairman & CEO. “Our determined licensing efforts continue unabated with many negotiations underway. We expect to sign several more licenses in the coming weeks and months.”
About WiLAN
WiLAN, founded in 1992, is a leading technology innovation and licensing company. WiLAN has licensed its intellectual property to 200 companies worldwide. Inventions in our portfolio have been licensed by companies that manufacture or sell a wide range of communication and consumer electronics products including 3G cellular handsets, Wi-Fi-enabled laptops, Wi-Fi/DSL routers, xDSL infrastructure equipment, WiMAX base stations and digital televisions. WiLAN has a large and growing portfolio of more than 720 issued or pending patents. For more information: www.wilan.com.
|
Related News
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |