English
Samsung Signs Multi-Year License For Tensilica's HiFi 2 Audio DSP
Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
Santa Clara, USA-November 19, 2009 - Tensilica, Inc. today announced that the Digital Media & Communications Business of Samsung Electronics has signed a multi-year license to Tensilica's HiFi 2 Audio DSP (digital signal processor) for use in Samsung's multimedia system products after a successful previous deployment in Samsung's System LSI Division. Tensilica's HiFi architecture is the most popular commercial audio core for system-on-chip (SOC) designs.
"We selected the Tensilica HiFi Audio DSP because of its impressive performance capabilities and because of the breadth of software codecs available," stated K.W. Chun, vice president, Digital Media & Communications Business of Samsung Electronics. "The HiFi 2 Audio DSP can execute the most demanding multi-channel audio algorithms at remarkably low MHz and low power."
"We are pleased that another major division of Samsung Electronics has selected our HiFi 2 Audio DSP for their next-generation home entertainment products," stated Jack Guedj, Tensilica's president and CEO.
About Tensilica
Tensilica, Inc. is the recognized leader in customizable dataplane processors. Dataplane Processor Units (DPUs) consist of performance intensive DSP (audio, video, imaging, and baseband signal processing) and embedded RISC processing functions (security, networking, and deeply embedded control). The automated design tools behind all of Tensilica's application specific processor cores enable rapid customization to meet specific data-plane performance targets. Tensilica's DSPs and processors power top tier semiconductor companies, innovative start-ups, and system OEMs for high-volume products including mobile phones, consumer electronics devices (including portable media players, digital TV, and broadband set top boxes), computers, and storage, networking and communications equipment. For more information on Tensilica's patented benchmark-proven DPUs visit www.tensilica.com.
|
||||||
Related News
- Samsung Signs Multi-Year License for Tensilica Diamond Standard 330HiFi Audio DSP
- Fujitsu Signs Multi-Year Corporate License for Tensilica's Audio, Baseband DSP and Dataplane Processor IP Cores
- Retune DSP Multi-Microphone Beamforming and Echo Cancellation Now Available for Cadence Tensilica HiFi Audio DSPs
- Dialog Semiconductor Licenses Cadence's Industry-Leading Tensilica Hifi Audio/Voice DSP IP
- Shanghai HDIC Picks Tensilica's HiFi Audio DSP For Digital Television System-on-Chip
Breaking News
- Green Hills Software Extends Multicore Interference Mitigation to Arm Cortex-A72 for DO-178C Level A Applications
- MediaTek Introduces Helio G35 & G25 Gaming Series Chipsets
- Aldec Adds Customizable Tool Qualification Data Package to ALINT-PRO for DO-254 Projects
- Innosilicon multiple high-speed interface IPs, based on the SMIC 14nm process, R&D and mass production proven
- Innosilicon IP helps Ingenic T20 win "China Chip" Excellent Market Performance Product Award
Most Popular
- Innosilicon IP helps Ingenic T20 win "China Chip" Excellent Market Performance Product Award
- OPENEDGES Network-on-Chip Interconnect IP and DDR Controller Licensed for GCT Semiconductor LTE Category 19 Chip
- Green Hills Software Extends Multicore Interference Mitigation to Arm Cortex-A72 for DO-178C Level A Applications
- Innosilicon multiple high-speed interface IPs, based on the SMIC 14nm process, R&D and mass production proven
- Dialog Semiconductor Announces Completion of its Acquisition of Adesto Technologies
|
E-mail This Article | 
|
|
Printer-Friendly Page |