New Software Releases From CoWare and Tensilica Support Advanced Software Development Capabilities of The CoWare Platform Architect and Virtual Platform Technology
SAN JOSE, Calif. & SANTA CLARA, Calif. -- December 16, 2009 -- CoWare®, Inc., the leading supplier of Electronic System Virtualization™ (ESV) software and services, and Tensilica®, Inc., the leading provider of configurable dataplane processor cores (DPUs), announced they have collaborated to further enhance the integration of Tensilica’s processor models into the CoWare tools to support CoWare’s advanced functionality to ease software development on multi-core Tensilica-based SOC (system-on-chip)designs. The enhanced solution is being used by joint CoWare-Tensilica customers in automotive, consumer and wireless markets.
CoWare virtual platforms are the virtualized representation of an electronic system used for the purpose of software development. It removes the dependency on the availability of expensive hardware prototypes and development test benches and provides cost-effective software development capabilities for debugging and analysis. The updated integration of Tensilica’s DPUs enables:
- Enhanced debug visibility combining CoWare Virtual Platform Analyzer with Tensilica’s software debugger;
- Reproducibility and predictability through a full scripting environment;
- High-speed simulation performance for the Tensilica subsystem thanks to the TurboXim mode of Tensilica’s ISS models;
- Multi-core software development solution through debug synchronization and debug and analysis visibility across all cores in the system.
The joint CoWare-Tensilica Processor Support Package (PSP) solution has been actively used by customers worldwide to explore the best architecture for a given application combining the versatility of the Tensilica cores with the architecture design solution from CoWare. Based on customer demand, this joint solution has been significantly enhanced to address the increased software development challenges of today’s multi-core designs. The unique combination of features, targeting the architect as well as the software developer, enables the joint solution to be used throughout the design process starting from the definition phase, then the development phase through to the deployment phase.
“CoWare’s ESV tools have been widely adopted by some of our largest customers,” said Steve Roddy, vice president of marketing, Tensilica. “Software development on multi-core designs is becoming increasingly critical to create differentiating products. Our partnership with CoWare is offering joint customers a unique solution to cope with the complexity and significantly pull in the design schedule with the ability to develop software before the hardware is available.”
“Tensilica cores are being used in a wide variety of applications,” said Marc Serughetti, vice president of marketing and business development at CoWare. “The power and flexibility of the configurable cores enables customers to combine multiple versions of the Tensilica cores in one design. The partnership between our two companies addresses multi-processor platform exploration and reuse, and early software development – by providing the best design and software development environment for our joint customers.”
Tensilica Xtensa® and Diamond Standard PSPs are available immediately from CoWare as part of the CoWare Model Library. For more information on these PSPs, CoWare Virtual Platform, CoWare Platform Architect, CoWare Model Library, and CoWare’s other products, visit www.coware.com. For more information on the Tensilica Xtensa® and Diamond Standard DPUs, visit www.tensilica.com.
Tensilica, Inc. is the recognized leader in customizable dataplane processors. Dataplane Processor Units (DPUs) consist of performance intensive DSP (audio, video, imaging, and baseband signal processing) and embedded RISC processing functions (security, networking, and deeply embedded control). The automated design tools behind all of Tensilica's application specific processor cores enable rapid customization to meet specific data-plane performance targets. Tensilica's DSPs and processors power top tier semiconductor companies, innovative start-ups, and system OEMs for high-volume products including mobile phones, consumer electronics devices (including portable media players, digital TV, and broadband set top boxes), computers, and storage, networking and communications equipment. For more information on Tensilica's patented benchmark-proven DPUs visit www.tensilica.com.
CoWare is the leading global supplier of Electronic System Virtualization software and services. IP, semiconductor, and electronics companies use CoWare virtualization solutions to design better processor- and software-intensive products faster. CoWare solutions solve the new design challenges associated with platform architecture design, platform verification, application sub-system design, processor design, DSP algorithm design, and software development, and are based on open industry standards including SystemC. These solutions also enable IP and semiconductor companies to implement more effective go-to-market strategies. CoWare's corporate investors include ARM [(LSE: ARM); (Nasdaq: ARMH)], Cadence Design Systems (NASDAQ: CDNS), STMicroelectronics (NYSE: STM), and Sony Corporation (NYSE: SNE). CoWare is headquartered in San Jose, Calif., and has offices around the world. For more information about CoWare and its products and services visit http://www.coware.com.