Dual Port Register File Compiler (1 Read-Only Port, 1 Write-Only Port)
MOSAID and Samsung Enter Standstill Agreement
OTTAWA, Ontario – Jan 04, 2010 - MOSAID Technologies Inc. (TSX:MSD) today announced that it has entered into an 19-day standstill agreement with Samsung Electronics Co., Ltd. MOSAID and Samsung have successfully negotiated a new agreement, that is subject to approval by both companies' Boards of Directors on or before January 18, 2010.
"The standstill agreement was put in place to cover the period between the expiration of our existing semiconductor agreement with Samsung on December 31, 2009, and the expected approval of the new agreement by Samsung's Board of Directors," said John Lindgren, President and CEO, MOSAID.
About MOSAID
MOSAID Technologies Inc. is one of the world’s leading intellectual property companies. MOSAID develops semiconductor memory technology and licenses patented intellectual property in the areas of semiconductors, and wired and wireless communications systems. MOSAID counts many of the world's largest semiconductor companies among its customers. Founded in 1975, MOSAID is based in Ottawa, Ontario.
For more information, visit www.mosaid.com.
|
Related News
- Cadence and Samsung Foundry Enter Multi-Year Agreement to Expand Design IP Portfolio
- MOSAID and Samsung Reach Comprehensive Agreement
- Mysticom and Samsung Electronics Enter Ethernet Technology Licensing Agreement
- MIPI Alliance and Automotive SerDes Alliance Enter Liaison Agreement to Enable Native MIPI CSI-2 Implementation with ASA-ML PHY
- Samsung Electronics and AMD Extend Strategic IP Licensing Agreement To Bring AMD Radeon™ Graphics to Future Mobile Platforms
Breaking News
- VSORA Raises $46 Million to Bring World's Most Powerful AI Inference Chip to Market
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
Most Popular
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- CFX 0.13μm eFuse OTP IP has been applied in the mass production of over 15,000 CMOS image sensors
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |