Magnum Semiconductor Launches a High Definition Video Compression IP Solution
Magnum's Video Compression IP Offers State of the Art High Definition Video Compression Technology to Semiconductor Companies
MILPITAS, CA -- January 7, 2010 -- Magnum Semiconductor, the leader in compression processors for Broadcast and Consumer markets, announced today it is launching an IP license business, which will provide its high-quality Video CODEC IP, proven through decades of deployment in Tier 1 video markets, to Semiconductor companies.
Magnum's Video compression IP solution is productized as a new line in addition to the existing product lines in the broadcast and consumer space. Being a leader in the arena of high quality compression chipsets, Magnum is now allowing IP solutions into selective arenas in need for best of breed processing. The new line is expected to have yearly refresh cycles and includes a rich feature set as well as comprehensive and proven software and toolsets.
"Our Video compression IP is unique. In addition to leveraging and benefiting from our leadership technology in the professional broadcast market, our IP, both hardware and software are productized and proven by our own Silicon products. So our IP customers can be assured of the quality and completeness of our IP solution," stated Gal Garniek, VP Marketing and Sales at Magnum Semiconductor. "Magnum is stepping up its support for the digital world. In addition to providing chipset solutions for broadcast systems and DVD/ BD Recorder and Set-top box markets, our new IP solutions serve our current and future customers in the Hybrid Digital Still Camera, Camcorder, Surveillance Camera, Surveillance Video Recorder, TV and Hand-Held SOC domains, by providing industry-leading compression IP solutions."
Magnum's High Definition IP package includes an extremely rich feature-functionality set. From encode, transcode, decode, resolutions 1080p to, formats which include H.264, MPEG2 and VC-1, to advanced networking encompassing internet compatibility, rate adaptive, fast channel and more.
About Magnum Semiconductor
Magnum Semiconductor is a leading provider of silicon, modules, software and IP for the professional broadcast infrastructure and compression-enabled consumer clients. Magnum provides top of the line products, tools and technologies for the entire video content creation and distribution chain, from content capture and production to its delivery to the home. Magnum Semiconductor is headquartered in Milpitas, California, with sales and engineering offices in Canada, China, Japan and Korea. Further information is available at www.magnumsemi.com.
|
Related News
- RFEL announces updates to its flagship "Video Fusion" high definition video processing IP core
- Aptina Announces Native 1080p System on Chip Solution for High Definition Video Imaging Applications
- Aspex Semiconductor wins National Microelectronics (NMI) Lower Power Green award for HD video compression technology
- ZiiLABS Selects High Performance Video DAC from S3 Group for High Definition TV Output
- Ittiam Unveils 60ms Ultra Low-Latency Streaming Systems for High Definition Video
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |