IDT Acquires Mobius Microsystems
Transaction Expands Available IDT Timing Market by $700 Million
SAN JOSE, Calif.-- January 14, 2010 --IDT® (Integrated Device Technology, Inc.)(NASDAQ: IDTI - News), a leading provider of essential mixed signal semiconductor solutions that enrich the digital media experience, today announced it has acquired Mobius Microsystems, the leader in precision all-silicon oscillator technology . The transaction, which closed today, January 14, 2010, is an all-cash agreement for the outstanding Mobius shares. The agreement has already received appropriate board approvals.
“Mobius Microsystems’ innovative technology extends IDT’s clock leadership into high accuracy, crystal oscillator replacements, thereby doubling our served available market,” said Dr. Ted Tewksbury, president and CEO at IDT. “Mobius’ patented all-silicon timing technology provides IDT with power, size, and time-to-market advantages over competitive offerings. IDT plans to quickly bring products to market using our existing worldwide sales and distribution channels. We expect customers to rapidly adopt this technology across multiple applications and segments, beginning with consumer and migrating to the computing and communications markets.”
Mobius specialized in innovative analog and mixed signal timing solutions. The company’s all-CMOS frequency source is a significant technical breakthrough for the timing market. Mobius’ all-silicon oscillator enables designers to create accurate, higher frequency, thinner and mechanically robust products.
About IDT
With the goal of continuously improving the digital media experience, IDT integrates its fundamental semiconductor heritage with essential innovation, developing and delivering low-power, mixed signal solutions that solve customer problems. Headquartered in San Jose, Calif., IDT has design, manufacturing and sales facilities throughout the world. IDT stock is traded on the NASDAQ Global Select Stock Market® under the symbol “IDTI.” Additional information about IDT is accessible at www.IDT.com.
|
Related News
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |