CEVA-X1641 DSP core delivers outstanding performance and flexibility for Sequans next-generation 4G processors
SAN JOSE, Calif., Feb. 10, 2010-- CEVA, Inc. (Nasdaq: CEVA); (LSE: CVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that Sequans Communications, a leading 4G chipmaker, has licensed the CEVA-X1641 DSP core to power its next generation LTE and WiMAX baseband processors. The CEVA-X1641 will provide further flexibility for Sequans' future generation baseband chips, while maintaining the chips' industry-leading low power rating.
"As the wireless industry continues to adopt a two-pronged approach towards 4G networks, it is critical that our next-generation product lines can support both LTE and WiMAX standards in a cost-efficient and flexible manner," said Bertrand Debray, Sequans VP of engineering. "The high-performance CEVA-X1641 DSP provides us with a programmable architecture with low cost of deployment, addressing the major challenges facing 4G chipset solutions for high-volume markets. Also, with significant legacy software, the high efficiency of the CEVA-X1641 compiler was an important criterion in our decision to adopt a new DSP architecture."
"Sequans is an industry leader in the WiMAX space and we are pleased to partner with them as they apply their expertise to LTE," said Eran Briman, VP of marketing at CEVA. "The programmable nature of the CEVA-X1641 DSP will enable Sequans to significantly reduce the overall costs and design risks associated with 4G chipsets by implementing the constantly evolving LTE and WiMAX standards in software rather than inflexible hardwired blocks."
CEVA's industry-leading DSP cores power many of the world's leading cellular baseband handset solutions. The company's broad customer base includes Infineon, ST-Ericsson, Broadcom, Samsung, Mediatek, Spreadtrum and VIA Telecom, among others. To date, more than 600 million CEVA-powered handsets have shipped. Addressing next-generation 4G terminal and infrastructure markets, the CEVA-X1641 and CEVA-XC DSPs have been specifically architected to overcome the stringent power consumption, time-to-market and cost constraints associated with developing high-performance WiMAX, LTE and software definable radio (SDR) wireless communications processors. CEVA has multiple licensees developing LTE handset and infrastructure solutions based on CEVA DSP cores.
About Sequans Communications
Sequans Communications is a 4G chipmaker, supplying LTE and WiMAX chips to equipment manufacturers and mobile operators worldwide. Founded in 2004 to address the WiMAX market where it is now a global leader, Sequans expanded in 2009 to address the LTE market. Sequans chips are inside the world's leading WiMAX networks and will soon be inside the world's leading LTE networks. Sequans is based in Paris, with additional offices throughout the world, including USA, United Kingdom, Israel, Japan, Hong Kong, Singapore, and Taiwan. www.sequans.com
About CEVA, Inc.
CEVA is the leading licensor of silicon intellectual property (SIP) DSP Cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia, HD audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2009, CEVA's IP was shipped in over 330 million devices, including handsets from all top five handset OEMs – Nokia, Samsung, LG, Motorola and Sony Ericsson. Today, more than one in every four handsets shipped worldwide is powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com