InterDigital Signs Casio Hitachi Mobile Communications to Worldwide 2G and 3G Patent License Agreement
KING OF PRUSSIA, Pa., Mar 09, 2010 -- InterDigital, Inc. (NASDAQ: IDCC) today announced that its patent licensing subsidiaries have entered into a worldwide, non-exclusive, patent license agreement with Casio Hitachi Mobile Communications Co., Ltd. ("CHMC"), headquartered in Japan. The license agreement covers the sale by CHMC of all wireless end-user terminal devices, such as mobile handsets, computers, etc., compliant with 2G and 3G cellular standards through the earlier of June 30, 2010 or the establishment of the announced mobile phone handset joint venture involving NEC Corp., Casio Computer Co., and Hitachi Ltd. InterDigital (R) expects to benefit from a one-time recognition of revenue related to past sales under this agreement and, based on the announced structure of the new joint venture, sales for covered products by the new joint venture will be included in InterDigital's total per unit royalty revenues once the new joint venture begins to operate.
"We are pleased to have resolved all outstanding patent licensing issues with CHMC," commented Lawrence Shay, President of InterDigital's patent holding subsidiaries. "This latest agreement further demonstrates the strength of our intellectual property, our global licensing program and our solid relationships with leading Japanese companies."
In addition, InterDigital has identified additional royalty obligations in a routine audit of an existing licensee. The new patent license agreement and resolution of the audit issues combined will add approximately $40 million in royalty revenue between the first and second quarters of 2010. The allocation of this revenue will depend on final resolution of the accounting treatment.
About InterDigital
InterDigital develops fundamental wireless technologies that are at the core of mobile devices, networks, and services worldwide. We solve many of the industry's most critical and complex technical challenges, inventing solutions for more efficient broadband networks and a richer multimedia experience years ahead of market deployment. InterDigital has licenses and partnerships with many of the world's leading wireless companies.
For more information, visit: www.interdigital.com
|
Related News
- InterDigital Signs SII Mobile Communications to Worldwide Patent License Agreement
- InterDigital Signs Pantech to Worldwide Patent License Agreement Covering 2G, 3G and LTE Standards
- InterDigital Signs Cinterion to Worldwide Patent License Agreement
- InterDigital Signs ModeLabs to Worldwide 2G and 3G Patent License Agreement
- InterDigital and Fujitsu Limited Agree to Worldwide Patent License Agreement
Breaking News
- Launching MosChip DigitalSky™ for Building Connected Intelligent Enterprises
- Crypto Quantique collaborates with ADLINK to simplify and enhance device security in industrial PCs
- Xiphera Partners with IPro for the Israeli Chip Design Market
- Siemens collaborates with GlobalFoundries to certify Analog FastSPICE for the foundry's high-performance processes
- EXTOLL collaborates with Frontgrade Technologies for High-Speed SerDes IP
Most Popular
- BrainChip Introduces Lowest-Power AI Acceleration Co-Processor
- Launching MosChip DigitalSky™ for Building Connected Intelligent Enterprises
- Siemens collaborates with GlobalFoundries to certify Analog FastSPICE for the foundry's high-performance processes
- RaiderChip brings Meta Llama 3.2 LLM HW acceleration to low cost FPGAs
- Crypto Quantique collaborates with ADLINK to simplify and enhance device security in industrial PCs
E-mail This Article | Printer-Friendly Page |