Newly Enhanced ESI-P3010 Features +/-1oC Accuracy with 16-bit Digital Readout Implemented in TSMC 65 nm-G CMOS Process
Santa Clara, Calif., March 15, 2010 – Ensphere Solutions, an emerging leader in advanced communications Integrated Circuits (ICs) and Intellectual Properties (IPs), today announced the availability of a new enhanced temperature sensor core.
Ensphere Solutions’ new ESI-P3010 is a power and area optimized IP implemented in mainstream processes such as TSMC 65nm-G and TowerJazz 180 nm. This core consists of a temperature sensor connected to one of the eight inputs of an analog multiplexer. The output of this multiplexer can be scaled by a programmable gain stage prior to being digitized by a 16-bit Sigma-Delta ADC. The remaining seven DC input channels can be used for signal monitoring and digitizing of other analog input signals. Virtually all key parameters of this core is user programmable per channel basis including the gain, calibration settings (offset and slope), and filter parameters. The total area of this IP is 0.25mm2 and total power dissipation is 4.9mW with all channels active. The total power down current is 19nA.
“The capabilities of this IP go far beyond a generic temperature sensor. It can be used to monitor die temperature as well as seven other DC levels. Highly customizable nature of this IP makes it suitable for most SoCs with various degrees of complexity” said Al Gharakhanian, Vice President of Marketing at Ensphere Solutions.
About Ensphere Solutions Inc.
Ensphere Solutions Inc., a privately held company, offers advanced communications semiconductor ICs, IP cores and professional design services. Based in Silicon Valley, CA, the company specializes in the development of standard and custom mixed signal transceivers and RF chips. The company’s standard products are targeted for high-speed optical data communications. www.enspheresolutions.com