NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Updated: Sequans' WiMax chip drives Sprint Nextel's first 4G phone
Junko Yoshida, EETimes
(03/18/2010 10:55 AM EDT)
NEW YORK — It turns out that it's Sequans Communications, not Beceem, whose WiMax chip was designed into Sprint Nextel's first WiMax (4G) phone, scheduled to be unveiled next week during the CTIA wireless show.
By extension, it isn't MIPS Technologies, but CEVA, that received a big boost, since Sequans is using CEVA's DSP core in its WiMax/LTE baseband silicon.
Sequans' communication director Kimberly Tassin contacted EE Times to reveal that her company's baseband silicon is driving Sprint Nextel's first 4G phone.
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