MOSAID Enters Into Wireless Patent License Agreement With Sharp
OTTAWA, ONTARIO -- April 5, 2010 -- MOSAID Technologies Inc. (TSX:MSD) today announced that it has entered into a worldwide, non-exclusive wireless patent license agreement with Sharp Corporation of Japan.
Under the terms of the wireless patent portfolio license agreement, MOSAID has granted Sharp a fixed-payment term license to MOSAID's wireless technology patents, covering certain wireless networking products, including handsets and notebook computers. The five-year license agreement is effective as of April 1, 2010. All other terms and conditions of the license agreement are confidential.
"We are very pleased that Sharp, the leading vendor of mobile handsets in Japan and renowned as a world leader in advanced technology, recognizes the value of our wireless patents," said John Lindgren, President and Chief Executive Officer, MOSAID. "Sharp is the third manufacturer of Wi-Fi enabled handsets to license MOSAID's wireless patents, and we anticipate continued success in licensing into this important market."
MOSAID has signed 14 wireless patent license agreements with global companies since 2008. The Company is currently licensing its wireless patent portfolio into four markets - mobile handsets, notebook and netbook computers, wireless infrastructure products, and gaming consoles.
About MOSAID
MOSAID Technologies Inc. is one of the world's leading intellectual property companies. MOSAID develops semiconductor memory technology and licenses patented intellectual property in the areas of semiconductors and telecommunications systems. MOSAID counts many of the world's largest technology companies among its licensees. Founded in 1975, MOSAID is based in Ottawa, Ontario. For more information, visit www.mosaid.com.
|
Related News
- MOSAID Signs Wireless Patent License Agreement With a Top-Ranked Semiconductor Supplier
- MOSAID Signs Wireless Patent License Agreement With Sony
- MOSAID Extends NXP's Patent License and Signs New Wireless Agreement; Provides update on Qimonda
- Huawei Enters Patent License Agreement for Fraunhofer IIS MPEG-4 Audio Patent Portfolio
- Core Wireless Announces Patent License Agreement With Global Consumer Electronics Manufacturer
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |