Dylan McGrath, EE Times
(05/25/2010 7:44 PM EDT)
SAN FRANCISCO—The probability that the semiconductor industry will one day use 450-mm silicon wafers in manufacturing has increased significantly, though the chance of achieving volume production by the original target date of 2012 is remote, according to a new report by analysts at Semico Research Corp.
Large chip vendors such as Intel Corp., Samsung Electronics Co. Ltd. and Taiwan Semiconductor Co. (TSMC) are clamoring for a migration 450-mm wafers, which would enable them to build more chips per die and increase profits. Now, even some equipment suppliers—many of which have resisted the move to 450-mm—are starting to come around, according to Semico (Phoenix).