Second generation automotive embedded flash IP achieves AEC-Q100 grade 1 qualification
Hsinchu, Taiwan, R.O.C. – May 27, 2010 - Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today announced the 0.18-mciron automotive Embedded Flash IP as its second generation Embedded Flash IP that passed AEC-Q100 product qualification requirements for a wide range of automotive applications.
TSMC’s 0.18-micron automotive Embedded Flash IP macro features 27 percent area reduction compared to an equivalent 0.25-micron Embedded Flash IP. The 0.18um technology generation hits a cost and performance sweet spot as vast amount of IPs have been developed for many applications. The addition of this 0.18-micron automotive qualified Embedded Flash IP enables customers to extend their current 0.18-micron product portfolios to automotive micro-controller applications.
The 0.18-micron automotive Embedded Flash process entered initial volume production last year. More than 38000 8-inch wafers or an equivalent number of 43 Million automotive MCU units have been shipped. So far TSMC had observed lower failure rate as compared to the previous generation 0.25 um in which 0.1ppm or less has been achieved.
Much of the learning in bringing the 0.25-micron Embedded Flash technology to production readiness has also resulted in a quicker time in achieving this new record for the new IP.
“This new milestone results from a truly synergistic alignment between TSMC’s strength in manufacturing consistency and our customers’ expertise in test methodology. It underscores TSMC’s relentless pursuit to meet the stringent automotive electronics requirements,” said Kuotung Cheng, director of automotive program at TSMC.
TSMC is the only foundry that provides AEC-Q100 qualified 0.25-micron and 0.18-micron Embedded Flash IP as general offers to all its customers.
TSMC is the world’s largest dedicated semiconductor foundry, providing the industry’s leading process technology and the foundry’s largest portfolio of process-proven libraries, IPs, design tools and reference flows. The Company’s managed capacity in 2009 totaled 9.96 million (8-inch equivalent) wafers, including capacity from two advanced 12-inch GIGAFABs™, four eight-inch fabs, one six-inch fab, as well as TSMC’s wholly owned subsidiaries, WaferTech and TSMC China, and its joint venture fab, SSMC. TSMC is the first foundry to provide 40nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.