Duolog Technologies Appoints New Vice President of North American Sales
DUBLIN, Ireland, June 15, 2010 - Duolog Technologies, the award-winning provider of Electronic Design Automation products and services for System-on-Chip integration, today announced that it has appointed Joe Hee as Vice President of North American Sales. Hee will drive Duolog’s continued expansion in the US and Canada where it has already achieved notable successes with world leading companies for its design integration tools.
“We are very pleased to welcome Joe to our management team” said Ray Bulger, co-founder and CEO of Duolog Technologies. “Joe has tremendous experience in the EDA and semiconductor markets from his broad ranging contributions to startup, maturing and established companies. He will play a key role in expanding our customer base across North America for our exciting range of products and services focused on improving IC integration and productivity”.
Hee, a highly experienced sales executive, brings more than 20 years experience in the EDA and Semiconductor industries to Duolog. Prior to joining Duolog, he was VP of Business Development at siXis, an early stage, VC funded semiconductor packaging company. Prior to siXis, he worked at Synplicity for ten years in various sales management roles including Director of Eastern Area Sales. Before Synplicity, he held various sales and sales management positions at Synopsys during a time of rapid growth for the company. Mr. Hee has also various geographic sales management roles at LSI Logic and Texas Instruments.
Mr. Hee holds a BSEE from Drexel University and an MBA from Duke University’s Fuqua School of Business.
About Duolog:
Duolog Technologies Ltd. is an award-winning provider of EDA tools and services that enable the flawless and rapid integration of today’s increasingly complex SoC, ASIC and FPGA designs. Duolog’s Socrates Chip Integration Hub employs a modular and extensible suite of tools for I/O layer definition, IP packaging, automated system assembly and register management.
|
Related News
- Juan M. Chapa Joins Tensilica as Vice President of North American Sales
- Artisan Appoints New Sales Vice President; R. Keith Hopkins To Lead Artisan's North America and Europe Sales Organizations
- Breker Verification Systems Appoints Andy Stein Vice President of Worldwide Sales as Company Scales New Business Opportunities
- Flex Logix Appoints Lee Leibig As Vice President Of Sales For AI Inference
- Flex Logix Appoints Dana McCarty as Vice President of Sales and Marketing for AI Inference Products
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |