China Mobile hosts demonstration using ST-Ericsson's TD-LTE chipset
Shanghai, China, July 12, 2010 - ST-Ericsson, a leader in wireless platforms and semiconductors, and Ericsson have showcased the first complete end-to-end TD-LTE solution. The demonstration follows the successful execution of TD-LTE interoperability testing (IOT) between ST-Ericsson’s device platform and mobile network equipment from Ericsson.
The next-generation of mobile broadband technology, known as LTE, has two versions; one for paired spectrum (FDD) and the other for unpaired spectrum (TDD). Designed for use in unpaired spectrum, TD-LTE is set to be deployed widely around the world.
At an event today hosted by China Mobile in Shanghai, Ericsson and ST-Ericsson demonstrated their complete TD-LTE solution for the first time. Using an USB dongle embedded with ST-Ericsson’s TD-LTE chipset, the companies successfully showcased super-fast mobile broadband applications, such as video-on-demand (VOD) and video streaming with a live camera.
Mats H Olsson, President of Ericsson China and North East Asia said: "The successful demonstration today reflects not only Ericsson's undisputed technology leadership in the LTE domain, but also our unwavering commitment to the development of TD-LTE in China and elsewhere in the world. We will make every effort to support China Mobile in bringing revolutionary mobile broadband experiences to tens of millions of Chinese consumers in the near future."
“Drawing on six years of LTE research and development, today’s demonstration underlines ST-Ericsson’s position as a frontrunner in the rollout of the next-generation of mobile broadband platforms,” said Magnus Hansson, Senior Vice President and head of LTE and 3G Modem Solutions at ST-Ericsson. “Through our cooperation with China Mobile and Ericsson, devices based on our chipsets will soon enable people to enjoy the many benefits of super-fast mobile broadband.”
A pioneer of LTE platform solutions, ST-Ericsson was the first in the world to demonstrate a handheld LTE device and to achieve LTE and HSPA mobility with a multimode device. Available next year, ST-Ericsson’s next generation modem will support both versions of LTE, in addition to TD-SCDMA and HSPA+/EDGE.
ST-Ericsson and Ericsson’s combined offering is the only complete end-to-end TD-LTE solution in the industry.
ST-Ericsson’s key milestones in LTE
In February 2010, ST-Ericsson announced its cooperation with China Mobile on the TD-LTE development: Read more
- 2009: Fully working LTE chipset available and interoperability testing of the platform with operators. In December, ST-Ericsson and Ericsson were first to achieve LTE and HSPA mobility with a multimode device. Read more
- 2008: Platform interoperability tests activities initiated with network vendors
- 2007: First handheld LTE prototype available and first handheld public demonstration at Mobile World Congress in 2008
- 2004-2005: ST-Ericsson started research and standardization activities related to LTE
About ST-Ericsson ST-Ericsson is a world leader in developing and delivering a complete portfolio of innovative mobile platforms and cutting-edge wireless semiconductor solutions across the broad spectrum of mobile technologies. The company is a leading supplier to the top handset manufacturers and ST-Ericsson’s products and technologies enable more than half of all phones in use today. The company generated pro-forma sales of about USD 2.7 billion in 2009. ST-Ericsson was established as a 50/50 joint venture by STMicroelectronics and Ericsson in February 2009, with headquarters in Geneva, Switzerland. More information on ST-Ericsson is available at www.stericsson.com.