Ericsson boosts the Bluetooth market
Ericsson boosts the Bluetooth market
November 12, 2001 - Ericsson Technology Licensing AB today announces new ways for original equipment manufacturers (OEMs) to bring Bluetooth products to market more quickly. Ericsson's new Bluetooth Special Interest Group (SIG)-accredited Bluetooth Qualification Test Services will provide an experienced channel for OEMs to qualify their Bluetooth products quickly and efficiently. In addition, Ericsson's new Design House Program will offer technical design and development expertise, shortening the time-to-market cycle for OEMs. Currently, two-thirds of Bluetooth products produced in volume use Bluetooth solutions from Ericsson.
Bluetooth Qualification Test Services
Early in 2002, Ericsson Technology Licensing will become an accredited test house for assisting OEMs with the SIG interoperability qualification process. The qualification process must be complete before an OEM can use the Bluetooth trademark and patent rights on a commercially available product.
"Since the creation of the Bluetooth SIG, Ericsson has been a main contributor to the development of the qualification and testing procedures," said Magnus Sommanson, responsible for test facility set up at Ericsson Technology Licensing. "Now we are making our experience in this area available to a broader scope of clients."
Design House Program
By the end of 2001, Ericsson Technology Licensing will also initiate a Design House Program to assist OEMs with Bluetooth development. The Design Houses will feature a network of System-On-Chip design experts. These experts will assist OEMs with chip design to fit their particular needs, thus allowing them to gain both security and time to market.
"Instead of settling for pre-made, standardized chips, OEMs can license chip technology and implement Bluetooth in a more cost-efficient manner. The Design Houses will offer the OEMs local access to Bluetooth wireless technology on a global basis," said Frank Hennekens, Director of Business Line Baseband, Ericsson Technology Licensing.
Ericsson is shaping the future of Mobile and Broadband Internet communication through its continuous technology leadership. Providing innovative solutions in more than 140 countries, Ericsson is helping to create the most powerful communication in the world.
FOR FURTHER INFORMATION, PLEASE CONTACT:
Frida Tibblin Citron, Manager Marketing Communication,
Ericsson Technology Licensing AB
Phone: +46 70 65 46 352 / +46 46 23 27 04
E-mail: Frida.TibblinCitron@ebt.ericsson.se
About Ericsson Technology Licensing
Ericsson Technology Licensing AB licenses intellectual property for Bluetooth wireless technology to many of the world's largest manufacturers. No company has been working longer or harder with Bluetooth wireless technology than Ericsson. Ericsson began Bluetooth research back in 1994, helped found the Bluetooth SIG and was the first company to put Bluetooth consumer products into mass production.
Read more at www.ericsson.com/bluetooth
The BLUETOOTH trademarks are owned by their proprietor and used by Ericsson under license.
Related News
- Siemens' new Calibre DesignEnhancer boosts Samsung Foundry design quality and speeds time to market
- CEVA Bluetooth® 5.4 IP Achieves SIG Qualification, Includes New Features to Address Rapidly Growing Electronic Shelf Label (ESL) Market
- Bluetooth SIG Introduces Wireless Standard for Electronic Shelf Label Market
- Broadcom Announces Bluetooth Smart SoC with Wireless Charging Support for Growing Wearable Market
- MindTree Unveils IP Suite to Target Bluetooth Low Energy Market
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |