Inside Intel's Sandy Bridge architecture
Rick Merritt, EETimes
9/13/2010 9:17 PM EDT
SAN JOSE, Calif. – Intel has officially entered the race to heterogeneous computer processors, sketching out the first members of its Sandy Bridge family that will ship before April. The 32nm chips will come in versions with two or four dual-threaded x86 cores and one graphics core on a shared ring interconnect.
The first Sandy Bridge parts are aimed at notebooks, desktops and single-socket servers. Versions with more cores aimed at multi-socket servers will follow later in the year or early in 2012.
The Intel CPUs will compete head on with parts from archrival Advanced Micro Devices such as Ontario, a 40nm CPU using two of AMD's new Bobcat cores and a Microsoft DirectX11-class graphics core. Ontario is sampling now, and AMD has similar desktop and server chips in the works for the second half of 2011.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- UBM TechInsights takes first look inside Intel's latest Ivy Bridge processor
- Intel's Ivy Bridge delayed says senior executive
- LatticeECP2M FPGA Enables Low Cost PCI Express Bridge for VOIP Platforms Based on Intel Architecture
- Intel Demonstrates Industry's First 32nm Chip and Next-Generation Nehalem Microprocessor Architecture
- Intel's XScale architecture debuts in network-processor chip set
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation