NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Light Peak panned by OEM, report
Rick Merritt, EETimes
9/22/2010 10:51 AM EDT
SAN JOSE, Calif. – Intel's first implementation of Light Peak will not be broadly adopted by PC makers, but it opens a door to future optical interconnects. That's the view of an engineer in one top-tier PC company and an analyst report published separately today.
PC makers are ramping up for a significant transition to the copper-based USB 3.0 that can deliver data at more than 3 Gbits/second. Most have no plans to use the 10 Gbits/second Light Peak, said a senior engineer at one top-tier PC maker who asked not to be named.
"I think there will be some who will use Light Peak, but not the volume OEMs like the Acers, HPs and Dells," said the PC engineer. "They won't have a need for it," he said.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- For notebooks, Light Peak is in, USB 3.0 is out? Join the conversation
- Fast interfaces overlap at IDF
- USB 3.1 Device & Host Controller IP Cores with highly configurable design for Superspeed data transfers in all kinds of advanced SoCs is available for immediate licensing
- M31 Technology and Corigine have launched the world's first USB-IF certified 28 nm Superspeed+ USB 3.1 Gen 2 IP Solution
- Corigine Unveils First Certified SuperSpeed+ USB 3.1 Gen 2 IP With M31 28nm PHY
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation