NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Analyst: TSMC faces slowdown
Mark LaPedus, EETimes
9/28/2010 1:10 PM EDT
SAN JOSE, Calif. - Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) is seeing a slowdown amid a lull in the IC market.
''Based on our inventory analysis, rising capacity estimates and demand adjustment, we estimate TSMC will see a fall in its utilization level within two to three quarters to 75 percent, from 104-105 percent in 2Q-3Q '10,'' ''said Andrew Lu, an analyst with Barclays Bank, in a report.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- TSMC's 3-nm Push Faces Tool Struggles
- Analysts: TSMC still faces 40-nm problems
- M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation
- Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC's A16 and N2P Process Technologies
- Synopsys and TSMC Usher In Angstrom-Scale Designs with Certified EDA Flows on Advanced TSMC A16 and N2P Processes
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation