Analysis: Inside Broadcom's bid for Beceem
Rick Merritt, EETimes
10/13/2010 9:03 AM EDT
SAN JOSE, Calif. – Beceem Communications has a solid team and solid financials, but not exactly the right product to get Broadcom Corp. into mainstream LTE markets quickly. But given Broadcom belief the 4G technology won't be widespread in handsets until at least 2015, the company has plenty of time to start new integrated designs that are the hallmark of its silicon strategy.
Broadcom bid $316 million to acquire Beceem which sells WiMax handset chips and has a multimode WiMax and LTE chip in development scheduled to sample early next year. That chip, the BCS500, will be in production in late 2011, according to an S-1 Beceem filed recently in an aborted plan to go public.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Analysis gives first look inside Apple's A4 processor
- Village Island Enhances its AI100 with intoPIX's JPEG XS Technology for Advanced Real-Time Analysis
- European Commission Approves Broadcom's Acquisition of VMware
- Broadcom Debuts Industry's First 5nm ASIC for Data Center and Cloud Infrastructure
- Synaptics to Acquire Rights to Broadcom's Wireless IoT Connectivity Business
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation