Microsemi Unveils 65-nm Embedded Flash Platform
- All Devices to Converge on Jointly Developed UMC 65-nm eFlash Technology
- New IP Friendly Architecture Offers More Functionality, Lower Power Consumption
- Company Offers Sneak Peek at Next-Generation FPGAs for Space
IRVINE, Calif., Nov. 8, 2010 -- Microsemi Corporation, a leading provider of semiconductor technology aimed at building a secure, smart, connected world, announced that its SOC Products Division, formerly known as Actel Corporation, today unveiled its new 65nm embedded flash platform, on which the company's next generation flash-based customizable SOCs (system-on-chips) will be built. Featuring a new, expandable 4-input LUT architecture, the company's low power, intelligent mixed signal and system critical series of SOCs will converge on state-of-the-art 65nm embedded flash process. Densities will increase an order of magnitude, offering twice the performance when compared to the previous generation. The new platform will maintain the company's low power leadership, providing 65 percent lower dynamic power while enhancing the Flash*Freeze feature to provide lower static current. Future devices will include industry-standard bus interfaces and also allow integration of hardened intellectual property such as embedded microprocessor cores, DSP blocks, high speed transceivers, memory interfaces, nonvolatile flash memory and programmable analog.
"More and more, the demand for low power, firm error immunity, security and integration are non-negotiable in today's designs," said Esam Elashmawi, vice president of product development at Microsemi's SoC Products Division. "With the move to 65nm, the increase in density and improvements in power and performance allow us to target a much larger portion of the industrial, medical, mil/aero, avionics, communications and consumer markets."
Microsemi and UMC are first to market with the 65-nm embedded flash process. First commercial silicon is already in house, with availability expected first half of 2011. Microsemi's SOC Products Division is concurrently launching its customer lead program for early adopters in the commercial and industrial markets who want early access to emerging technology for their next generation designs.
Flash in Space
With over 20 years of commitment and innovation in the space and avionics industry, Microsemi's SOC Products Division, formerly known as Actel, fortifies its stronghold in the control systems of satellites. "We intend to extend our leadership in the market, targeting payload applications where performance, density and signal processing capabilities are key requirements," continued Mr. Elashmawi. "The reprogrammability and unparalleled reliability of our nonvolatile, flash technology is a very compelling solution."
Microsemi also offered a sneak peek at the next generation radiation tolerant (RT) flash-based SOCs. The 4th generation RT FPGAs will feature up to 20 million gates, offering a larger array of flip-flops, memory and hardened embedded IP cores. The devices will include digital signal processing (DSP) blocks, PLLs and high speed interfaces (such as SpaceWire, DDR2/3, PCI Express) to get data on and off chip quickly and efficiently. The new flash-based FPGA architecture provides mitigation to total dose radiation and single event effects (SEE). When compared to SRAM FPGAs, Microsemi's radiation-tolerant flash-based FPGAs have intrinsic configuration immunity to single event upsets (SEU), removing the need for board level mitigation schemes.
Due to the normally long design cycles in the space industry, the company has been engaging with customers for over a year now regarding the next generation space-flight FPGAs. The 5th Worldwide Actel Space Forum Series will kick off on December 2, 2010 in Los Angeles.
About Microsemi
Microsemi Corporation offers the industry's most comprehensive portfolio of semiconductor technology. Committed to solving the most critical system challenges, Microsemi's products include high-performance, high-reliability analog and RF devices, mixed signal integrated circuits, FPGAs and customizable SoCs, and complete subsystems. Microsemi serves leading system manufacturers around the world in the defense, security, aerospace, enterprise, commercial, and industrial markets. Learn more at www.microsemi.com.
|
Microsemi Hot IP
Related News
- Cypress and UMC Deliver ICs on New 65-Nanometer SONOS Embedded Flash Technology
- Cypress Signs Innopower to Enable SONOS-Based Embedded Flash Solutions for 130-nm and 65-nm Technology Nodes
- Zhuhai Chuangfeixin Introduces eNOR Embedded Flash Memory IP Solution and SPI NOR Flash Products on 65nm Floating-Gate Flash Process
- Toshiba Launches ARM Cortex-M3-based Microcontrollers with Latest 65nm Flash Embedded Logic Process for Motor Control and Consumer Devices
- Hua Hong Semiconductor Launches 0.11um Ultra-Low-Leakage Embedded Flash Process Platform That Delivers Powerful MCU Solutions for IoT
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
E-mail This Article | Printer-Friendly Page |