Analyst: Intel buying into wireless
Mark LaPedus, EETimes
11/8/2010 3:55 PM EST
SAN JOSE, Calif. - After years' of trying to enter the wireless chip fray, Intel Corp. is buying its way back into the arena-again, according to an analyst.
Recently, for example, Intel bought Infineon’s baseband business.Infineon's wireless business unit, which is in the process of being acquired by Intel Corp., is taking over Blue Wonder Communications GmbH, a specialist in LTE communications. Blue Wonder (Dresden, Germany) was founded in 2008 and provides LTE intellectual property. The company concluded a funding round in 2009, and the 50-person company claims to have orders for its technology.
E-mail This Article | Printer-Friendly Page |
Related News
- Intel Acquires Fujitsu Wireless
- Intel to Acquire Infineon's Wireless Solutions Business
- Intel Announces Termination of Tower Semiconductor Acquisition
- Tower Announces Termination of Intel Acquisition Agreement
- Cyient to Acquire Portugal-Based Celfinet to Strengthen its Wireless Communications Offerings
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024