CUPERTINO, Calif., November 09, 2010 – Ralink Technology Corporation (TAIEX 3534, Ralink), a leading developer of high performance wired and wireless networking solutions, today announced that it has filed a patent infringement lawsuit against German xDSL chip manufacturer Lantiq. The complaint was filed on November 8, 2010, in the United States Federal Court in the Western District of Wisconsin.
The lawsuit accuses Lantiq of intentionally violating Ralink’s intellectual property in a range of products including DSL chipsets, DSL controllers, Ethernet chipsets, Ethernet switches, Ethernet controllers, and Ethernet physical layer components, router chipsets, and other chipsets and components used in routers, switches and modems.. Ralink seeks a court injunction to halt imports of all infringing products into the United States, to have Lantiq cover all related litigation expenses, and for Lantiq to pay compensatory damages.
Ralink is among the fastest growing xDSL semiconductor suppliers in the market with over 21% market share in 2009 according to iSuppli Corporation. Ralink’s xDSL business has grown by over 35% in 2010, and in conjunction with the company’s high-performance Wi-Fi solutions Ralink is on track to become the number two global supplier of xDSL chips within the next 12 to 18 months.
About Ralink Technology
Ralink Technology Corporation is a leading innovator and developer in the wireless home networking and broadband access semiconductor markets. Ralink products are recognized for their superior throughput, extended range, low-power consumption, and reliability. Ralink’s patented Optilink™ technology extends Wi-Fi applications from traditional PC networking to a range of digital multimedia and handheld devices including cell phones, PDAs, cameras, print servers, HDTV, video game players and xDSL gateways. Ralink Technology was founded in 2001 with headquarters in HsinChu, Taiwan, R&D centers in Cupertino, California & Suzhou, China, and sales offices in China, Europe, Japan.