English
Xilinx Enables Leading Wireless Platform & Semiconductor Company to Speed Wireless Products to Market With FPGA-Based Prototyping System
System allows company to quickly prototype ASSP designs & jumpstart software development
SAN JOSE, Calif., Nov. 16, 2010 -- Xilinx, Inc. (Nasdaq: XLNX) and ST-Ericsson, a world leader in wireless platforms and semiconductors, today announced that ST-Ericsson is developing a next-generation PEPS-2 application-specific standard product (ASSP) prototyping platform based on Xilinx's high performance Virtex(R)-6 FPGAs.
The new platform for emulation, prototyping and software development will include up to six high performance Virtex-6 FPGAs and will allow software development prior to ASSP silicon availability. ST-Ericsson deployed its first generation PEPS system, which included six Virtex-4 FPGAs, to develop its highly acclaimed U8500 Smartphone Platform.
The upcoming PEPS-2 system will allow customers to develop even larger and more complex ASSP platforms and run the system faster, with much lower power, due to the Virtex-6 FPGAs.
About Xilinx
Xilinx is the world's leading provider of programmable platforms. For more information, visit www.xilinx.com.
|
||||||
Xilinx, Inc. Hot IP
Related News
- Hiroshima University Research Team Accelerates the Development of a Computer-Aided Medical Diagnosis System with Cadence Tensilica Vision P6 DSP Core and Protium S1 FPGA-Based Prototyping Platform
- HyperSilicon Releases Xilinx- XCVU440 Based FPGA-Based Prototyping Platform for VLSI (Very Large Scale Integration)Verification
- Aldec Enters the ASIC Prototyping Market with HES-7
- Customisable wireless medical sensor chip with machine learning accelerator enables mass market advanced medical and vital-sign monitors
- Amlogic Reduces HW/SW Integration Time for Multimedia SoCs by Two Months Using the Cadence Protium S1 FPGA-Based Prototyping Platform
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
|
E-mail This Article | 
|
|
Printer-Friendly Page |