MIPI Universal D-PHY IP - 4.5Gbps/lane, MIPI D-PHY v2.5 Compliant in TSMC 22ULP
Xilinx Enables Leading Wireless Platform & Semiconductor Company to Speed Wireless Products to Market With FPGA-Based Prototyping System
System allows company to quickly prototype ASSP designs & jumpstart software development
SAN JOSE, Calif., Nov. 16, 2010 -- Xilinx, Inc. (Nasdaq: XLNX) and ST-Ericsson, a world leader in wireless platforms and semiconductors, today announced that ST-Ericsson is developing a next-generation PEPS-2 application-specific standard product (ASSP) prototyping platform based on Xilinx's high performance Virtex(R)-6 FPGAs.
The new platform for emulation, prototyping and software development will include up to six high performance Virtex-6 FPGAs and will allow software development prior to ASSP silicon availability. ST-Ericsson deployed its first generation PEPS system, which included six Virtex-4 FPGAs, to develop its highly acclaimed U8500 Smartphone Platform.
The upcoming PEPS-2 system will allow customers to develop even larger and more complex ASSP platforms and run the system faster, with much lower power, due to the Virtex-6 FPGAs.
About Xilinx
Xilinx is the world's leading provider of programmable platforms. For more information, visit www.xilinx.com.
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