Renesas and Imagination show POWERVR SGX MP enabled SoC
New device delivers exceptional graphics compute density for mobile and embedded applications
December 8, 2010 -- Imagination Technologies’ partner Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, has debuted a new SoC (System-on-Chip) with POWERVR SGX MP (multi-processor) graphics. The SoC delivers impressive levels of mobile and embedded graphics performance, over 5x that of the best current generation devices..
The Renesas mobile applications processor delivers a new level of graphics compute density with significantly enhanced performance per mm2 and per mW. The device, incorporating Imagination’s POWERVR Series5XT MP graphics technology was demonstrated in silicon for the first time today (December 6th) at Imagination’s exclusive annual industry event at the British Embassy in Tokyo.
Imagination CEO Hossein Yassaie says: “Customer demand for advanced graphics, essential for console-class gaming and engaging user interfaces, and the debut of GP-GPU APIs like OpenCL, is driving the required compute density of GPUs in mobile and embedded products on a dramatic upward path. Users will not settle for ‘just good enough’ graphics – they are actively choosing products that deliver the very best in UI, media, gaming and navigation. This new processor from Renesas will deliver the capabilities to drive mobile and embedded graphics devices to power the next level of graphics-rich user experiences.”
More than 10 SoCs utilizing multi-processor POWERVR SGX MP cores are currently in design or in silicon.
The COO of Renesas Mobile Corporation, the newly established spin off of Renesas Electronics Corporation which has taken ownership of the Multimedia Processor and Platform Business, Shinichi Yoshioka says: “We see a strong demand for ever increasing graphics performance to support the exciting, rich-user-interface applications becoming standard on smart phones, car-infotainment systems and many other high performance products used in all walks of life. The adoption into Renesas processors of POWERVR SGX543 MP, with its best-in-class graphics performance, will enable our customers to develop attractive, leading edge products to meet such market needs.”
POWERVR SGX MP has full backward compatibility with current POWERVR SGX Cores enabling the work of our extensive POWERVR Insider ecosystem, which has deployed nearly half a million apps onto the existing 400+ million unit POWERVR user-base, to continue to evolve seamlessly into the next generation of graphics-rich products while being stimulated by SGX MP to take their content to the next level of performance.
About Imagination Technologies
Imagination Technologies Group plc (LSE:IMG) – a global leader in multimedia and communication technologies – creates and licenses market-leading processor cores for graphics, video, multi-threaded embedded processing/DSP and multi-standard communications applications. These silicon intellectual property (IP) solutions for systems-on-chip (SoC) are complemented by platform level IP and services, a strong array of software tools and drivers and extensive developer and middleware ecosystems. Target markets includemobile phone, handheld multimedia, home consumer entertainment, mobile and low-power computing, and in-car electronics.Its licensees include many of the leading semiconductor and consumer electronics companies. Imagination has corporate headquarters in the United Kingdom, with sales and R&D offices worldwide. See: www.imgtec.com.
|
Imagination Technologies Group plc Hot IP
Related News
- Renesas Mobile to Demonstrate the Industry's First POWERVR SGX MP Enabled Mobile Application Processor at Mobile World Congress 2011
- Imagination Technologies Licenses Third POWERVR SGX Graphics Core to Renesas
- Renesas Technology Corp. Licenses Imagination Technologies' PowerVR SGX
- Renesas Launches SoC Utilising Imagination Technologies' PowerVR MBX Graphics Core Targeting the In-car Market
- Imagination GPU Powers Renesas R-Car Gen 5 SoC
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |