CEVA Announces Licensing Agreement With PMC-Sierra for Voice-Over-IP Platform to Enable VoIP in Fiber-to-the-Home SoC Solutions
Powered by CEVA-TeakLite-II DSP core, CEVA-VoP™ brings lowest cost per channel VoIP capabilities to PMC-Sierra's GPON products
MOUNTAIN VIEW, Calif., Dec. 14, 2010 -- CEVA, Inc. (Nasdaq: CEVA); (LSE: CVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that PMC-Sierra (Nasdaq: PMCS), the premier Internet infrastructure semiconductor solution provider, has licensed its CEVA-VoP™ voice-over-IP platform for use in PMC-Sierra's next generation system-on-chip (SoC) devices for Fiber-To-The-Home applications. CEVA-VoP is a complete hardware and software VoIP solution based on the CEVA-TeakLite-II DSP, designed to be deployed in integrated networking and VoP SoCs.
The CEVA-VoP platform is built on top of the widely adopted, fully programmable CEVA-TeakLite-II low-cost DSP engine, and the Xpert-TeakLite-II integrated subsystem – with cached memory, peripherals, and system interfaces – capable of handling multiple, simultaneous voice channels on a single core. The solution includes a fully integrated VoIP software suite, including speech compression and decompression, echo cancellation, telephony functions, and signaling/networking. The incorporated software is open, allowing design licensees to add proprietary algorithms and broaden the use of the design to other markets or applications.
"We required a complete hardware plus software VoIP solution that can be efficiently integrated within our SoC architecture and provide the necessary performance, power and cost efficiencies required in the competitive EPON and GPON markets," said Ofer Bar-Or, PMC-Sierra's vice president and co-general manager, FTTH division. "CEVA's proven VoIP platform provides our EPON and GPON products with the required technology to enable multiple simultaneous voice channels and signal processing functions in our VoIP-enabled SoCs."
"We are pleased that PMC-Sierra has adopted our DSP-based platform to provide VoIP functionality," said Gideon Wertheizer, CEO of CEVA. "The flexibility of the CEVA solution is well suited to support PMC-Sierra's evolving needs as it continues to enhance its product lines with additional VoIP functionality."
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia, HD video and audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2009, CEVA's IP was shipped in over 330 million devices, powering handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony Ericsson and ZTE. Today, more than one in every three handsets shipped worldwide is powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com.
About PMC-Sierra, Inc.
PMC-Sierra®, the premier Internet infrastructure semiconductor solution provider, offers its customers technical and sales support worldwide through a network of offices in North America, Europe, Israel and Asia. PMC-Sierra provides semiconductor solutions for Enterprise and Channel Storage, Wide Area Network Infrastructure, Fiber-To-The-Home, and Laser Printer/Enterprise market segments. The Company is publicly traded on the NASDAQ Stock Market under the PMCS symbol. For more information, visit www.pmc-sierra.com.
|
Ceva, Inc. Hot IP
Related News
- BroadLight Selects CEVA VoIP Platform for GPON Residential Gateway SoC
- Ceva and Edge Impulse Join Forces to Enable Faster, Easier Development of Edge AI Applications
- ASPEED and CEVA Collaborate to Enable Superior Voice Experience on 2nd Generation Cupola360 SoC for Smart Cameras and Video Conferencing Systems
- Synopsys to Enable New Levels of Insight into SoC Designs and Systems with Industry's First Silicon Lifecycle Management Platform
- SiFive Selects Synopsys Fusion Design Platform and Verification Continuum Platform to Enable Rapid SoC Design
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |