MOSAID and IBM Sign Patent License Agreement, Resolve Patent Litigation Suit
OTTAWA, ONTARIO-- Dec. 16, 2010 -- MOSAID Technologies Inc. (TSX:MSD) today announced that it has entered into a patent license agreement with IBM Corporation (NYSE:IBM) of Armonk, New York. A separate settlement agreement effectively ends the pending litigation between MOSAID and IBM.
Under the terms of the non-exclusive worldwide patent license agreement, IBM receives a five-year license to certain of MOSAID patents. IBM's processor and Application Specific Integrated Circuit (ASIC) products that contain embedded DRAM are licensed under the agreement. IBM will make a series of fixed payments to MOSAID during the term of the agreement. All other terms of the patent license and settlement agreements are confidential.
About MOSAID
MOSAID Technologies Inc. is one of the world's leading intellectual property companies. MOSAID licenses patented intellectual property in the areas of semiconductors and telecommunications systems, and develops semiconductor memory technology. MOSAID counts many of the world's largest technology companies among its licensees. Founded in 1975, MOSAID is based in Ottawa, Ontario. For more information, please visit www.mosaid.com and InvestorChannel.mosaid.com.
|
Related News
- Ericsson and Apple sign global patent license agreement, settle litigation
- WiLAN and Several Subsidiaries Sign Comprehensive Semiconductor License Agreement with SK hynix
- Rambus and Socionext Sign Broad Patent License Agreement
- Rambus and Marvell Sign Patent License Agreement
- Rambus Licenses Patents and Technology Solutions to IBM
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |