Mark LaPedus, EETimes
1/24/2011 8:52 PM EST
SAN JOSE, Calif. – Despite a sudden surge in fab tool activity for the next-generation wafer size, 450-mm fabs will emerge later than sooner and the production target appears to have slipped.
This comes to no surprise to analysts, as the recent recession appears to have delayed 450-mm fab and tool investments. As reported, Intel, Samsung and TSMC have talked about having 450-mm prototype fabs by 2012. Intel Corp. is readying D1X, a 450-mm ''capable’’ fab. The new development fab in Oregon is slated for R&D startup in 2013.
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