WiLAN Provides Settlement Update
OTTAWA, Canada – January 31, 2011 – Wi-LAN Inc. (“WiLAN” or the “Company”) (TSX:WIN), a leading technology innovation and licensing company, today announced that the Company has reached settlement terms with Marvell Semiconductor, Inc., 2Wire, Inc., Belkin International, Inc., Netgear, Inc., Lenovo (United States), Inc., and Westell Technologies Inc. (collectively, the “defendants”). The amounts to be paid by the defendants and other terms of the settlements reached are confidential.
WiLAN expects to reach settlements with remaining defendants Apple, Inc., Dell, Inc., D-Link Systems, Inc., Hewlett Packard Company, Sony Electronics Inc. and Toshiba America Systems, Inc. with respect to Wi-Fi products only. The trial with respect to Wi-Fi products, which is scheduled to begin on February 2, 2011, is therefore not expected to proceed.
About WiLAN
WiLAN, founded in 1992, is a leading technology innovation and licensing company. WiLAN has licensed its intellectual property to over 240 companies worldwide. Inventions in our portfolio have been licensed by companies that manufacture or sell a wide range of communication and consumer electronics products including 3G cellular handsets, Wi-Fi-enabled laptops, Wi-Fi/DSL routers, xDSL infrastructure equipment, WiMAX base stations and digital television receivers. WiLAN has a large and growing portfolio of more than 970 issued or pending patents. For more information: www.wilan.com.
|
Related News
Breaking News
- Renesas and SiFive Partner to Jointly-Develop Next-Generation High-End RISC-V Solutions for Automotive Applications
- CAES Gaisler Signs Contract with the European Space Agency for New Advanced Space Processor
- Pinnacle Imaging Systems Announces Denali 3.0 Soft ISP & HDR Sensor Module for New Xilinx Kria SOM Platform and Vision AI Starter Kit
- Xilinx Introduces Kria Portfolio of Adaptive System-on-Modules for Accelerating Innovation and AI Applications at the Edge
- Synopsys Unleashes PrimeSim Continuum Solution to Accelerate the Design of Hyper-Convergent ICs for Memory, AI, Automotive and 5G Applications
Most Popular
- TSMC certifies Aprisa place-and-route solution from Siemens on TSMC's N6 process
- TSMC Boosts Capital Budget Again, to $30B
- Expedera Introduces Its Origin Neural Engine IP With Unrivaled Energy-Efficiency and Performance
- Revenue of Top 10 IC Design (Fabless) Companies for 2020 Undergoes 26.4% Increase YoY Due to High Demand for Notebooks and Networking Products, Says TrendForce
- Groq Closes $300 Million Fundraise
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |