Mark LaPedus, EETimes
1/31/2011 3:33 PM EST
SAN JOSE, Calif. - Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) has disclosed plans that it will build a 450-mm fab, according to an analyst.
As reported, Intel, Samsung and TSMC are pushing hard for 450-mm fabs. Amid a flurry of speculation, Intel Corp. confirmed that its new fab in the United States is being constructed for the 450-mm wafer era.
Now, TSMC tipped its plans. ''Last week, (TSMC CEO) Morris Chang obsoleted the world’s 300-mm with the blast of a conference call,'' said G. Dan Hutcheson, CEO of VLSI Research Inc., in a report.
Click here to read more ...