768x39 Bits OTP (One-Time Programmable) IP, TSMC 55ULP 0.9V–1.2V / 2.5V
TSMC tips 450-mm fab
Mark LaPedus, EETimes
1/31/2011 3:33 PM EST
SAN JOSE, Calif. - Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) has disclosed plans that it will build a 450-mm fab, according to an analyst.
As reported, Intel, Samsung and TSMC are pushing hard for 450-mm fabs. Amid a flurry of speculation, Intel Corp. confirmed that its new fab in the United States is being constructed for the 450-mm wafer era.
Now, TSMC tipped its plans. ''Last week, (TSMC CEO) Morris Chang obsoleted the world’s 300-mm with the blast of a conference call,'' said G. Dan Hutcheson, CEO of VLSI Research Inc., in a report.
E-mail This Article | Printer-Friendly Page |
|
Related News
Breaking News
- Europe Leaps Ahead in Global AI Arms Race, Joining $20 Million Investment in NeuReality to Advance Affordable, Carbon-Neutral AI Data Centers
- Synopsys Showcases EDA Performance and Next-Gen Capabilities with NVIDIA Accelerated Computing, Generative AI and Omniverse
- Spectral Releases Advanced Quality Assurance & Data Analytics tool to validate advanced node Memory Compilers
- TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production
- After TSMC fab in Japan, advanced packaging facility is next
Most Popular
- After TSMC fab in Japan, advanced packaging facility is next
- HBM3 Initially Exclusively Supplied by SK Hynix, Samsung Rallies Fast After AMD Validation, Says TrendForce
- Alphawave Semi Demonstrates 3nm Silicon-Proven 24Gbps Universal Chiplet Express (UCIe) Subsystem for High-Performance AI Infrastructure
- Weebit Nano to demo its ReRAM technology on GlobalFoundries' 22FDX® platform
- We'll Need Many More Fabs to Meet $1 Trillion by 2030 Goal